ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage ................................................................................. +7.5V
Output Current ............................................................... See SOA Curves
Signal Input Terminals (pins 2, 5, 6, and 9):
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
Voltage(2) ............................................... (V–) – 0.5V to (V+) + 0.5V
Current(2) ................................................................................ ±10mA
Output Short-Circuit(3) ........ Continuous when thermal protection enabled
Current Monitor (pin 19) Short-Circuit..................................... Continuous
Enable Pin (pin 8) .......................................... (V–) – 0.5V to (V–) + 7.5V
PowerPAD (pins 1, 10, 11, 20, and pad) ...... (V–) – 0.5V to (V–) + 0.5V
Current Limit Set (pin 3)................................. (V–) – 0.5V to (V+) + 0.5V
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those specified is
not implied. (2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less. (3) Short-circuit to ground.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
PIN CONFIGURATION
PIN DESCRIPTIONS
PIN #
1, 10, 11, 20
2
NAME
DESCRIPTION
Top View
SO
PowerPAD
Parallel Out 1
PowerPAD Connection Pins
Connection for Paralleling Multiple
Amplifiers
OPA569
3
4
Current Limit Set
Current Limit Flag
Current Limit Set Pin
Indicates When Part is in Current
Limit (Active LOW).
PowerPAD(1)
1
2
3
4
5
6
7
8
9
20 PowerPAD(1)
19 IMONITOR
18 V–(3)
5
6
7
–In
+In
Inverting Input
Parallel Out 1
Current Limit Set
Current Limit Flag
–In
Noninverting Input
Thermal Flag
Indicates Thermal Stress (Active
LOW)
17 V–(3)
Metal
PowerPAD
Heat Sink
(Located
on
8
9
Enable
Enabled HIGH. Shut down LOW.
16 NC(2)
Parallel Out 2
Connection for Paralleling Multiple
Amplifiers
(3)
+In
15 VO
12, 13
14, 15
16
V+
VO
Positive Power-Supply Voltage
Output
bottom
side)
(3)
Thermal Flag
Enable
14 VO
13 V+(3)
NC
No Internal Connection
Negative Power-Supply Voltage
17, 18
19
V–
Parallel Out 2
12 V+(3)
IMONITOR
Provides 1:475 Bidirectional Copy
of Output Current.
PowerPAD(1) 10
11 PowerPAD(1)
NOTES: (1) PowerPAD pins 1, 10, 11, and 20 and the
PowerPAD should be connected to the most negative
supply (V–) in either single or split supply configurations.
(2) NC means no internal connection.
(3) The following pin pairs must be connected together:
12 and 13; 14 and 15; 17 and 18.
OPA569
SBOS264A
2
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