Datasheet > OPA4991-Q1

OPA4991-Q1

更新时间： 2022-06-24 15:42:58

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
54页	3662K
描述
OPAx991-Q1 Automotive, 40-V Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp

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OPA4991-Q1 数据手册

OPA991-Q1, OPA2991-Q1, OPA4991-Q1

SBOSA12D – MARCH 2020 – REVISED SEPTEMBER 2021

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6.5 Thermal Information for Dual Channel

OPA2991-Q1

DGK

UNIT

THERMAL METRIC ⁽¹⁾

(SOIC)

8 PINS

132.6

73.4

(VSSOP)

8 PINS

176.5

68.1

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

76.1

98.2

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

24.0

12.0

ψ_JB

75.4

96.7

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information for Quad Channel

OPA4991-Q1

(TSSOP)

DYY

(SOT-23)

THERMAL METRIC ⁽¹⁾

UNIT

(SOIC)

14 PINS

101.4

57.6

14 PINS

118.0

47.6

14 PINS

110.7

55.9

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

°C/W

57.3

60.9

35.3

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

18.5

6.0

2.3

ψ_JB

56.9

60.4

35.1

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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