OPA320, OPA2320
OPA320S, OPA2320S
www.ti.com
SBOS513D –AUGUST 2010–REVISED NOVEMBER 2011
THERMAL INFORMATION: OPA320, OPA320S
OPA320
DBV (SOT23)
5 PINS
219.3
OPA320S
DBV (SOT23)
6 PINS
177.5
THERMAL METRIC(1)
UNITS
θJA
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
θJC(top)
θJB
107.5
108.9
57.5
27.4
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
7.4
13.3
ψJB
56.9
26.9
θJC(bottom)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2320, OPA2320S
OPA2320
DGK (MSOP)
8 PINS
174.8
OPA2320S
DGS (MSOP)
10 PINS
171.5
THERMAL METRIC(1)
D (SO)
8 PINS
122.6
67.1
DRG (DFN)
8 PINS
50.6
UNITS
θJA
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
θJC(top)
θJB
43.9
54.9
43.0
64.0
95.0
25.2
91.4
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
13.2
2.0
0.6
1.9
ψJB
63.4
93.5
25.3
89.9
θJC(bottom)
N/A
N/A
5.7
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S