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OPA211AID

更新时间： 2024-01-13 18:33:54
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路光电二极管
页数 文件大小 规格书
9页 329K
描述
1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package

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中文翻译

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OPA211AID 技术参数

生命周期：Active零件包装代码：DFP
包装说明：QFP, SOP8,.4针数：8
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：6 weeks
风险等级：2.13放大器类型：OPERATIONAL AMPLIFIER
架构：VOLTAGE-FEEDBACK最大平均偏置电流 (IIB)：0.125 µA
25C 时的最大偏置电流 (IIB)：0.25 µA最小共模抑制比：110 dB
标称共模抑制比：120 dB频率补偿：YES
最大输入失调电流 (IIO)：0.15 µA最大输入失调电压：260 µV
JESD-30 代码：R-CDFP-G8长度：6.9 mm
低-偏置：NO低-失调：YES
微功率：NO负供电电压上限：-20 V
标称负供电电压 (Vsup)：-15 V功能数量：1
端子数量：8最高工作温度：210 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：QFP封装等效代码：SOP8,.4
封装形状：RECTANGULAR封装形式：FLATPACK
包装方法：TUBE峰值回流温度（摄氏度）：NOT SPECIFIED
功率：NO电源：+-2.25/+-18/4.5/36 V
可编程功率：NO认证状态：Not Qualified
座面最大高度：2.8 mm标称压摆率：27 V/us
子类别：Operational Amplifier最大压摆率：7.5 mA
供电电压上限：20 V标称供电电压 (Vsup)：15 V
表面贴装：YES技术：BIPOLAR
温度等级：MILITARY端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED标称均一增益带宽：45000 kHz
最小电压增益：316227.766宽带：YES
宽度：5.65 mmBase Number Matches：1

OPA211AID 数据手册

 浏览型号OPA211AID的Datasheet PDF文件第3页浏览型号OPA211AID的Datasheet PDF文件第4页浏览型号OPA211AID的Datasheet PDF文件第5页浏览型号OPA211AID的Datasheet PDF文件第7页浏览型号OPA211AID的Datasheet PDF文件第8页浏览型号OPA211AID的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Jan-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOIC  
MSOP  
MSOP  
SOIC  
SOIC  
Drawing  
OPA211AID  
OPA211AIDGKR  
OPA211AIDGKT  
OPA211AIDR  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
D
DGK  
DGK  
D
8
8
8
8
8
75  
2500  
250  
2500  
75  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
POPA211AID  
D
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...3456789

中文翻译

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OPA211AID 替代型号

型号 品牌 替代类型 描述 数据表
OPA211AIDRG4 TI

类似代替

 1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDG4 TI

完全替代

 1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDR TI

类似代替

 1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package

与OPA211AID相关器件

型号 品牌 获取价格 描述 数据表
OPA211AIDG4 TI

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 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDGKR TI

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 		1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package
OPA211AIDGKRG4 TI

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 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDGKT TI

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 		1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package
OPA211AIDGKTG4 TI

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 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDR TI

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 		1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package
OPA211AIDRG4 TI

获取价格

 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDRGR TI

获取价格

 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDRGRG4 TI

获取价格

 		1.1nV/√Hz Noise, Low Power, Precision Opera
OPA211AIDRGT TI

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 		1.1nV/√Hz Noise, Low Power, Precision Opera

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