Datasheet > OPA210

OPA210

更新时间： 2022-05-14 22:22:40

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
42页	2642K
描述
OPAx210 2.2-nV/âHz Precision, Low-Power, 36-V Operational Amplifiers

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OPA210 数据手册

OPA210, OPA2210

SBOS924H – SEPTEMBER 2018 – REVISED AUGUST 2021

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6.4 Thermal Information: OPA210

OPA210

THERMAL METRIC⁽¹⁾

D (SOIC)

8 PINS

131.2

71.6

DGK (VSSOP)

8 PINS

171.3

64.7

DBV (SOT-23)

5 PINS

180.4

UNIT

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

67.9

74.6

92.4

102.1

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

22.4

10.4

ψ_JB

73.8

90.9

100.3

R_θJC(bottom)

N/A

(1) For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application

report.

6.5 Thermal Information: OPA2210

OPA2210

THERMAL METRIC⁽¹⁾

D (SOIC)

8 PINS

126.1

65.7

DGK (VSSOP)

8 PINS

132.7

38.5

DRG (SON)

8 PINS

52.1

UNIT

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

51.8

69.5

52.1

24.8

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

17.4

2.4

1.1

ψ_JB

68.9

52.8

24.8

R_θJC(bot)

n/a

9.0

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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