Datasheet > OPA187IDGKT

OPA187IDGKT

更新时间： 2022-02-26 10:06:14

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
45页	2408K
描述
0.001-Î¼V/Â°C Drift, Low Power, Rail-to-Rail Output 36-V Operational Amplifiers Zero-Drift Series

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OPA187IDGKT 数据手册

OPA187, OPA2187, OPA4187

SBOS807D –DECEMBER 2016–REVISED DECEMBER 2018

www.ti.com

6.4 Thermal Information: OPA187

OPA187

5 PINS

8 PINS

THERMAL METRIC⁽¹⁾

UNIT

DGK

(VSSOP)

DBV (SOT-23)

D (SOIC)

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

273.8

159

100.1

°C/W

R_θJC(top)

R_θJB

126.8

85.9

10.9

84.9

n/a

42.4

41.0

4.8

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

1.2

77.1

n/a

ψ_JB

40.3

n/a

R_θJC(bot)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2187

OPA2187

THERMAL METRIC⁽¹⁾

8 PINS

DGK (VSSOP)

159

UNIT

D (SOIC)

100.1

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

42.4

41.0

4.8

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

1.2

77.1

n/a

ψ_JB

40.3

n/a

R_θJC(bot)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4187

OPA4187

THERMAL METRIC⁽¹⁾

14 PINS

PW (TSSOP)

16 PINS

RUM (WQFN)

35.3

UNIT

D (SOIC)

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

107.8

29.6

52.6

1.5

83.8

70.7

59.5

11.6

37.7

n/a

°C/W

R_θJC(top)

R_θJB

32.7

12.9

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.3

ψ_JB

51.6

n/a

12.9

R_θJC(bot)

3.3

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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