NTHS5404
Power MOSFET
20 V, 7.2 A, N−Channel ChipFETE
Features
• Low R
for Higher Efficiency
DS(on)
http://onsemi.com
• Logic Level Gate Drive
• Miniature ChipFET Surface Mount Package Saves Board Space
• Pb−Free Package is Available
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
20 V
25 mW @ 4.5 V
7.2 A
Applications
• Power Management in Portable and Battery−Powered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Steady
State
G
Rating
Symbol 5 Secs
Unit
V
Drain−Source Voltage
Gate−Source Voltage
Continuous Drain Current
V
V
20
DS
GS
S
"12
V
N−Channel MOSFET
I
A
D
(T = 150°C) (Note 1)
J
7.2
5.2
5.2
3.8
T = 25°C
A
ChipFET
CASE 1206A
STYLE 1
T = 85°C
A
Pulsed Drain Current
I
"20
A
A
DM
Continuous Source Current
(Diode Conduction) (Note 1)
I
S
7.2
5.2
PIN
MARKING
DIAGRAM
CONNECTIONS
Maximum Power Dissipation
(Note 1)
P
W
D
2.5
1.3
1.3
0.7
T = 25°C
A
8
1
2
3
4
1
8
7
6
5
D
D
D
G
D
D
D
S
T = 85°C
A
2
3
4
7
6
5
Operating Junction and Storage
Temperature Range
T , T
J
−55 to +150
°C
stg
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
A2 = Specific Device Code
M = Month Code
1. Surface Mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
ORDERING INFORMATION
†
Device
Package
Shipping
NTHS5404T1
NTHS5404T1G
ChipFET
3000/Tape & Reel
3000/Tape & Reel
ChipFET
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
October, 2004 − Rev. 3
NTHS5404T1/D