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NTHS5441T1 PDF预览

NTHS5441T1

更新时间: 2024-02-26 08:44:13
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管开关
页数 文件大小 规格书
6页 67K
描述
−20 V, −5.3 A, P−Channel ChipFET

NTHS5441T1 数据手册

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NTHS5441  
Power MOSFET  
−20 V, 5.3 A, P−Channel ChipFET]  
Features  
Low R  
DS(on)  
http://onsemi.com  
Higher Efficiency Extending Battery Life  
Logic Level Gate Drive  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Miniature ChipFET Surface Mount Package  
Pb−Free Package is Available  
−20 V  
46 mW @ −4.5 V  
−5.3 A  
S
Applications  
Power Management in Portable and Battery−Powered Products; i.e.,  
Cellular and Cordless Telephones and PCMCIA Cards  
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Steady  
State  
D
Rating  
Drain−Source Voltage  
Gate−Source Voltage  
Continuous Drain Current  
Symbol  
5 sec  
Unit  
V
P−Channel MOSFET  
V
DS  
V
GS  
−20  
"12  
V
I
D
A
8
ChipFET  
CASE 1206A  
STYLE 1  
(T = 150°C) (Note 1)  
J
−5.3  
−3.8  
−3.9  
−2.8  
T = 25°C  
A
T = 85°C  
A
1
Pulsed Drain Current  
I
"20  
A
A
DM  
Continuous Source Current  
(Note 1)  
I
S
−5.3  
−3.9  
PIN  
CONNECTIONS  
MARKING  
DIAGRAM  
Maximum Power Dissipation  
(Note 1)  
P
W
D
8
7
6
5
1
2
3
4
D
D
D
S
D
D
D
G
1
2
3
4
8
7
6
5
2.5  
1.3  
1.3  
0.7  
T = 25°C  
A
T = 85°C  
A
Operating Junction and Storage  
Temperature Range  
T , T  
J
−55 to +150  
°C  
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
A3 = Specific Device Code  
M = Month Code  
G
= Pb−Free Package  
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq  
[1 oz] including traces).  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTHS5441T1  
ChipFET  
3000/Tape & Reel  
ChipFET  
(Pb−Free)  
NTHS5441T1G  
3000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
July, 2005 − Rev. 13  
NTHS5441T1/D  
 

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