Datasheet > NP383-28804-P

NP383-28804-P

更新时间： 2022-12-22 05:10:20

品牌	Logo	应用领域
YAMAICHI		/
页数	文件大小	规格书
1页	170K
描述
Chip Scale Package -TH (CSP, 0.50mm Pitch)

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NP383-28804-P 数据手册

NP383 Series (Open Top)

Chip Scale Package -TH (CSP, 0.50mm Pitch)

Specifications

Part Num ber (Details)

Ω

1,000M m in. at 100V DC

Dielectric Withstanding Voltage: 100V AC for 1 m inute

Insulation Resistance:

NP383

Series No.

*** 09 *

Ω

100m m ax. at 10m A/20m V m ax.

Contact Resistance:

Operating Tem perature Range: –40°C to +150°C

No. of Contact Pins

Design Num ber

10gf per pin approx.

2.2kg ±0.5

Contact Force:

Operating Force:

Positioning Pin: N = Without

P = With

Features

Materials and Finish

Housing:

Polyetherim ide (PEI), glass-filled

µ Open top socket for BGA

Polyetherssulphone (PES), glass-filled

Through hole 0.5m m pitch

2-point Tweezer Contacts

Contacts:

Plating:

Beryllium Copper (BeCu)

Gold over Nickel

Exam ple Socket Dim ensions

Contact Details

Recom m ended PC Board Layout

Top View from Socket

2-point Tweezer Style Contact

Free

Open

Test

Part Num ber

Grid Size

Body size

Socket Dim ensions

Centre Grid size

NP383-18010-*

NP383-28804-*

NP383-84107-*

10x18

18x18

29x29

11.0x12.5

10.0x10.0

15.0x15.0

19.5x26.0

36.0x36.0

33.0x33

no grid centre

6x6

7x7

SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

Test & Burn-In

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