【
NR4010/NR4012/NR4018 type
】【
NR3010/NR3012/NR3015 type】�【NP04 type】�
【NP05DZB type】�
PRECAUTIONS
SMD Inductors
Stages
Precautions
Technical considerations
1.Circuit Design
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
2.PCB Design
Land pattern design
1.Please contact any of our offices for a land pattern, and refer
to a recommended land pattern of specifications.
Surface Mounting�
5
YMounting and soldering conditions should be checked beforehand.�
YApplicable soldering process to this products is reflow soldering only.�
YRecommended Land Patterns�
1
.
9
4.8
Pattern
prohibition
belt
2
2.7
.
9
3.7
。�
45
1
.9
5.9
2.5
0.8 1.4 0.8
1.2 1.6 1.2
4.8
1
.6
【NR10050 type】�
【NR6012 type】�
1.7
3.5 1.7
【NP06DZB type】�
6.2
4.5
5.7
Pattern
prohibition
belt
2.6
5.4
2.6
1.15 3.7 1.15
7.0
2.5
【N06D type】�
【N05D type】�
【N08D type】�
6.2
2.0
2.5
2.5
1.7
4.9 1.7
UnitDmm
3.5
4.2
3.5
1.7 3.5 1.7
1.7
4.9
1.7
3.Considerations for
automatic placement
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may
deform the products.
4.Soldering
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
【NR30/40/60 Type】
【08 Type, 04/05/06 Type】
3.Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
Recommended reflow condition fPb free solderg
Recommended reflow condition fPb free solderg
240V250C Within 5sec
250
300
200
100
PeakD250J5/K0C
5sec max
200
180
150
150V180C
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
(03/04/05/06/08, NR10050 type)
30M10sec�
230C min
100
50
0
90M30sec
100V120sec
40V60sec
0
Heating Time[sec]
Duration[sec]
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
Recommended reflow condition fPb solderg
10sec max
Recommended reflow condition fPb solderg
230V240C Within 5sec
300
200
100
250
PeakD
240M5C
200
180
150
150M10C
60V70
The soldering iron should not directly touch the inductor.
sec
30sec�
max
100
50
0
80V100sec
200M5C
110sec max
40sec max
0
Heating Time[sec]
Duration[sec]
【NR10050 Type】�
Recommended reflow condition fPb free solderg
�
300
200
100
250J5/K0C
230C or more
30M10sec
180C
150C
90M30sec
0
Heating Time[sec]
5.Cleaning
6.Handling
Cleaning conditions
1.SMD Inductors
Please contact any of our offices for a cleaning,
Handling
1.There is a case that a characteristic varies with magnetic influence.
1.Keep the product away from all magnets and magnetic
objects.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.There is a case to be damaged by a mechanical shock.
1.Please do not give the product any excessive mechanical
shocks.
2.There is a case to be broken by the handling in transportation.
2.Please do not add any shock and power to a product in
transportation.
Pick-up pressure
1.Damage and a characteristic can vary with an excessive shock or stress.
1.Please do not push to add any pressure to a winding part.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.There is
accumulation of a packing box.
a case that transformation and a product of tape are damaged by
1.Please avoid accumulation of a packing box as much as
possible.
Storage
7.Storage conditions
1.Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
・Recommended conditions
ꢀAmbient temperatureꢀꢀꢀꢀꢀ 0～40℃
ꢀHumidity
ꢀBelow 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
product should be used within one year from the time of
delivery.�
In case of storage over
6 months, solderability shall be
checked before actual usage.
391
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