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NJG1156PCD PDF预览

NJG1156PCD

更新时间: 2024-02-01 03:26:20
品牌 Logo 应用领域
NJRC 电信电信集成电路
页数 文件大小 规格书
20页 493K
描述
Telecom Circuit, 1-Func, HFFP-10

NJG1156PCD 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.19
JESD-30 代码:S-XDMA-N10长度:2.5 mm
功能数量:1端子数量:10
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:MICROELECTRONIC ASSEMBLY座面最大高度:0.63 mm
标称供电电压:1.8 V表面贴装:NO
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:DUAL
宽度:2.5 mmBase Number Matches:1

NJG1156PCD 数据手册

 浏览型号NJG1156PCD的Datasheet PDF文件第14页浏览型号NJG1156PCD的Datasheet PDF文件第15页浏览型号NJG1156PCD的Datasheet PDF文件第16页浏览型号NJG1156PCD的Datasheet PDF文件第17页浏览型号NJG1156PCD的Datasheet PDF文件第18页浏览型号NJG1156PCD的Datasheet PDF文件第19页 
NJG1156PCD  
I PACKAGE OUTLINE (HFFP10-CD)  
TOP VIEW  
SIDE VIEW  
BOTTOM VIEW  
Package Size  
:2.5±0.1mm  
0.63mm max.  
Electrode Dimensions clearance  
: ±0.05mm  
Standꢀoff  
:0.1mm max.  
Unit  
: mm  
Substrate  
Terminal treat  
Lid  
: Ceramic  
: Au  
: SnAg/Kovar/Ni  
: 18.00mg  
Weight (typ.)  
Exposed PAD  
Ground connection is required.  
[CAUTION]  
Cautions on using this product  
The specifications on this databook are only  
given for information , without any guarantee  
as regards either mistakes or omissions.  
The application circuits in this databook are  
described only to show representative usages of  
the product and not intended for the guarantee or  
permission of any right including the industrial  
rights.  
This product contains GalliumꢀArsenide (GaAs) which is a harmful material.  
Do NOT eat or put into mouth.  
Do NOT dispose in fire or break up this product.  
Do NOT chemically make gas or powder with this product.  
To waste this product, please obey the relating law of your country.  
This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle with care to avoid these damages.  
This product is hollow seal package type, and it is with the structure susceptible to stress from the outside. Therefore, note the following in  
relation to the contents, after conducting an evaluation, please use.  
1. After mounting this product, to implement the potting and transfer molding, please the confirmation of resistance to temperature changes  
and shrinkage stress involved in the molding.  
2. When mounted on the product, collet diameter please use more than 1mmφ. In addition, the value of static load is recommended mounting  
less than 5N.  
3. For dynamic load at the time of mounting, please use it after confirming in consideration of the contact area / speed / load.  
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