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NJG1156PCD PDF预览

NJG1156PCD

更新时间: 2024-01-28 01:33:26
品牌 Logo 应用领域
NJRC 电信电信集成电路
页数 文件大小 规格书
20页 493K
描述
Telecom Circuit, 1-Func, HFFP-10

NJG1156PCD 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.19
JESD-30 代码:S-XDMA-N10长度:2.5 mm
功能数量:1端子数量:10
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:MICROELECTRONIC ASSEMBLY座面最大高度:0.63 mm
标称供电电压:1.8 V表面贴装:NO
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:DUAL
宽度:2.5 mmBase Number Matches:1

NJG1156PCD 数据手册

 浏览型号NJG1156PCD的Datasheet PDF文件第14页浏览型号NJG1156PCD的Datasheet PDF文件第15页浏览型号NJG1156PCD的Datasheet PDF文件第16页浏览型号NJG1156PCD的Datasheet PDF文件第18页浏览型号NJG1156PCD的Datasheet PDF文件第19页浏览型号NJG1156PCD的Datasheet PDF文件第20页 
NJG1156PCD  
I Evaluation board  
(Top View)  
PCB  
Substrate: FRꢀ4  
Thickness: 0.2mm  
Microstrip line width: 0.4mm (Z0=50)  
Size: 14.0mm x 14.0mm  
VDD  
V
CTL  
C1  
RF IN  
RF OUT  
L1  
<PCB LAYOUT GUIDELINE>  
PCB  
PKG Terminal  
PKG Outline  
GND Via Hole  
Diameter φ= 0.2mm, 0.4mm  
PRECAUTIONS  
• Please layout ground pattern under this FEM in order not to couple with RFIN and RFOUT terminal.  
• All external parts should be placed as close as possible to the FEM.  
• For good RF performance, all GND terminals must be connected to PCB ground plane of substrate,  
and viaꢀholes for GND should be placed near the FEM.  
ꢀ 17 ꢀ  

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