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NIN-FC8R2KTRFNIN-FC8R2KTRF PDF预览

NIN-FC8R2KTRFNIN-FC8R2KTRF

更新时间： 2023-06-15 00:00:00
品牌 Logo 应用领域
尼吉康 - NICHICON /
页数 文件大小 规格书
12页 111K
描述
GENERAL PURPOSE INDUCTOR

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NIN-FC8R2KTRFNIN-FC8R2KTRF 数据手册

 浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第2页浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第3页浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第4页浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第5页浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第6页浏览型号NIN-FC8R2KTRFNIN-FC8R2KTRF的Datasheet PDF文件第7页 
NIN Series  
Molded Chip Wirewound Inductors  
FEATURES  
RoHS  
• EIA SIZES A (1210), B (1812), C (1008) AND D (0805)  
Compliant  
includes all homogeneous materials  
• EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS  
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE  
• HIGH INDUCTANCE AVAILABLE IN SMALL SIZE  
*See Part Number System for Details  
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE  
AVAILABLE TYPE AND RANGE  
Inductance  
Range  
EIA Size  
Size Code Size (L x W x H mm)  
NIC Type  
Style  
0805  
D
2.0 x 1.25 x 1.25  
NIN-ND  
NIN-FC  
NIN-NC  
NIN-PC  
NIN-FA  
NIN-NA  
NIN-PA  
NIN-FB  
10nH ~ 1.0μH  
0.22 ~ 100μH  
10nH ~ 0.82μH  
1.0 ~ 33μH  
0.22 ~ 220μH  
47nH ~ 8.2μH  
1.0 ~ 330μH  
0.1 ~ 1000μH  
Standard  
Standard  
High Frequency  
High Curret  
Standard  
High Frequency  
High Current  
Standard  
1008  
C
2.5 x 2.0 x 1.6  
1210  
1812  
A
B
3.2 x 2.5 x 2.2  
4.5 x 3.2 x 3.2  
SPECIFICATIONS  
Case Size  
Specifications  
0805  
1008  
1210  
1812  
Inductance Range  
Inductance Tolerance  
10nH ~ 1.0μH  
±10% (K), ±5% (J)  
10nH ~ 100μH  
47nH ~ 330μH  
0.10μH ~ 1000μH  
±10% (K), ±5% (J)  
±20% (M), ±10% (K), ±5% (J)  
-25°C ~ +85°C (at 100% of rated voltage)  
1,000 MegOhm Min. (@ 100Vdc, Termination to Case)  
250Vdc for 1 minute (Termination to Case)  
Operating Temperature Range  
Insulation Resistance  
Withstanding Voltage  
Q Factor, Self Resonant Frequency,  
DC Resistance, Rated DC Current  
and Inductance Tolerance  
See Individual Product Listings  
ENVIRONMENTAL CHARACTERISTICS  
Test  
Specification  
Test Method & Condition  
Solderability  
Humidity  
Soldering Effect  
Low Frequency Vibration  
Thermal Shock  
90% Min. Coverage  
After 3 Sec. Dip in +230°C Solder Pot (Post Flux)  
After 500 Hrs at +60°C and 90~95% RH  
After 5 Sec. at +260°C (5 min. 120°C Pre-Heat)  
After 2 Hrs per Axis, 10 ~ 55Hz, 1.5mm Amplitude  
After 100 Cycles (-40°C ~ +85°C) 30 Min. Each  
After 500 Hrs at -40°C  
(1) No Evidence of Damage  
(2) Inductance Shall Be Within  
±5% of Initial Value  
(3) Q Factor Shall Be Within  
±10% of Initial Value  
Low Temperature Storage  
High Temperature Load  
Life  
(1) No Evidence of Damage  
(2) Inductance Shall Be Within  
±10% of Initial Value  
After 500 Hrs. at +85°C with Rated DC Current  
(3) Q Factor Shall Be Within  
±10% of Initial Value  
After 500 Hrs at +60°C with 90~95% RH  
at Rated DC Current  
Humidity Load Life  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
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