NDF60N550U1,
NDD60N550U1
Product Preview
N-Channel Power MOSFET
600 V, 550 mW
Features
http://onsemi.com
• 100% Avalanche Tested
V
R
MAX
DS(ON)
(BR)DSS
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
600 V
550 mW @ 10 V
Compliant
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise
J
N−Channel MOSFET
D (2)
noted)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
NDF
NDD
Unit
V
V
DSS
600
25
V
GS
V
G (1)
Continuous
Drain
Steady
State
T
=
I
9.5
6
8.5
5.4
96
A
C
D
25°C
Current
R
S (3)
T
C
=
q
JC
100°C
(Note 1)
Power
Steady
State
T
C
=
P
28
W
4
D
Dissipation –
R
25°C
q
JC
Pulsed Drain
Current
t = 10 ms
I
38
34
A
p
DM
1
2
3
1
2
3
Operating Junction and Storage
Temperature
T ,
−55 to +150
9.5 8.5
°C
J
T
STG
TO−220FP
CASE 221AH
IPAK
CASE 369D
Source Current (Body Diode)
I
S
A
Single Pulse Drain−to−Source
Avalanche Energy
EAS
TBD
mJ
4
Lead Temperature for Soldering
Leads
T
L
260
°C
2
1
3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by maximum junction temperature
DPAK
CASE 369AA
MARKING AND ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
THERMAL RESISTANCE
Parameter
Junction−to−Case (Drain)
Symbol
Value
Unit
NDF60N550U1
NDD60N550U1
R
4.4
1.3
°C/W
q
JC
Junction−to−Ambient Steady State
R
°C/W
q
JA
NDF60N550U1
50
33
96
NDD60N550U1
NDD60N550U1−1
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
October, 2012 − Rev. P1
NDF60N550U1/D