是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | TSOP, TSOP5/6,.11,37 | Reach Compliance Code: | compliant |
Factory Lead Time: | 5 weeks | 风险等级: | 5.63 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G5 | 长度: | 3 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 5 | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP |
封装等效代码: | TSOP5/6,.11,37 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
筛选级别: | AEC-Q100 | 座面最大高度: | 1.1 mm |
最大供电电流 (Isup): | 0.0014 mA | 最大供电电压 (Vsup): | 10 V |
最小供电电压 (Vsup): | 0.8 V | 标称供电电压 (Vsup): | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 阈值电压标称: | +4.5V |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.5 mm |
Base Number Matches: | 1 |
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