是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | TSSOP, TSOP5/6,.11,37 | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 4 weeks |
风险等级: | 5.67 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 5 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
筛选级别: | AEC-Q100 | 座面最大高度: | 1.1 mm |
最大供电电流 (Isup): | 0.0012 mA | 最大供电电压 (Vsup): | 10 V |
最小供电电压 (Vsup): | 0.8 V | 标称供电电压 (Vsup): | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 阈值电压标称: | +1.7V |
宽度: | 1.5 mm | Base Number Matches: | 1 |
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