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MXMLL3032 PDF预览

MXMLL3032

更新时间: 2024-11-20 05:20:43
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 161K
描述
Zener Diode, 33V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

MXMLL3032 数据手册

 浏览型号MXMLL3032的Datasheet PDF文件第2页浏览型号MXMLL3032的Datasheet PDF文件第3页 
1N3016BUR-1 thru 1N3051BUR-1, e3  
(or MLL3016B thru MLL3051B, e3)  
Surface Mount 1.5 W  
S C O T T S D A L E D I V I S I O N  
GLASS ZENER DIODES  
DESCRIPTION  
APPEARANCE  
This surface mountable zener diode series is similar to the 1N3016 thru  
1N3051 JEDEC registration in the DO-13 package except that it meets the  
surface mount DO-213AB outline. It is an ideal selection for applications of  
high density and low parasitic requirements. Due to its glass hermetic seal  
qualities and metallurgically enhanced internal construction, it is also well  
suited for high-reliability applications. This can be acquired by a source  
control drawing (SCD), or by ordering device types with MQ, MX, or MV  
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.  
DO-213AB  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Leadless surface mount package equivalents to the  
JEDEC registered 1N3016 thru 1N3051 except with  
higher power rating of 1.5 Watts  
Regulates voltage over a broad operating current  
and temperature range  
Wide selection from 6.8 to 200 V  
Tight voltage tolerances available  
Low reverse (leakage) currents  
Leadless package for surface mounting  
Ideal for high-density mounting  
Ideal for high-density mounting  
Voltage range: 6.8 to 200 volts  
Hermetically sealed, double-slug glass construction  
Metallurgically enhanced contact construction.  
Options for screening in accordance with MIL-PRF-  
19500/115 for JAN, JANTX, JANTXV, and JANS with  
MQ, MX, MV, or MSP prefixes respectively for part  
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,  
etc.  
Metallurgically enhanced internal contact design for  
greater reliability and lower thermal resistance  
Nonsensitive to ESD  
Hermetically sealed glass package  
Specified capacitance (see Figure 2)  
Axial lead “thru-hole” DO-13 packages per JEDEC  
registration available as 1N3016B thru 1N3051B (see  
separate data sheet with MIL-PRF-19500/115  
qualification)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
RoHS Compliant devices available by adding “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 1.5 watts (also see  
derating in Figure 1).  
CASE: Hermetically sealed glass MELF package  
TERMINALS: Tin-lead or RoHS compliant  
annealed matte-Tin plating solderable per MIL-  
STD-750, method 2026  
Operating and Storage temperature: -65ºC to  
+175ºC  
Thermal Resistance: 40 ºC/W junction to end cap,  
or 120ºC/W junction to ambient when mounted on  
FR4 PC board (1 oz Cu) with recommended  
footprint (see last page)  
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to the opposite end for Zener regulation  
MARKING: Cathode band only  
Steady-State Power: 1.50 watts at end-cap  
temperature TEC < 115oC, or 1.25 watts at TA = 25ºC  
when mounted on FR4 PC board and  
recommended footprint as described for thermal  
resistance (also see Figure 1)  
TAPE & REEL optional: Standard per EIA-481-1-A  
with 12 mm tape, 1500 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
WEIGHT: 0.05 grams  
See package dimensions on last page  
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (max)  
Copyright © 2006  
3-12-2006 REV D  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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