MX29GL320E T/B
MX29GL320E H/L
AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY..................................................................... 24
ERASING THE MEMORY ARRAY.............................................................................................................. 25
SECTOR ERASE........................................................................................................................................ 25
CHIP ERASE............................................................................................................................................. 26
ERASE SUSPEND/RESUME..................................................................................................................... 27
SECTOR ERASE RESUME ....................................................................................................................... 27
PROGRAM SUSPEND/RESUME .............................................................................................................. 28
PROGRAM RESUME................................................................................................................................. 28
BUFFER WRITE ABORT............................................................................................................................ 28
AUTOMATIC SELECT OPERATIONS........................................................................................................ 29
AUTOMATIC SELECT COMMAND SEQUENCE....................................................................................... 29
READ MANUFACTURER ID OR DEVICE ID............................................................................................. 30
RESET ....................................................................................................................................................... 30
ADVANCED SECTOR PROTECTION/UN-PROTECTION......................................................................... 31
Figure 1. Advance Sector Protection/Unprotection SPB Program Algorithm.............................................. 31
Figure 2. Lock Register Program Algorithm................................................................................................ 32
Figure 3. SPB Program Algorithm............................................................................................................... 34
SECURITY SECTOR FLASH MEMORY REGION..................................................................................... 37
FACTORY LOCKED: SECURITY SECTOR PROGRAMMED AND PROTECTED AT THE FACTORY..... 37
CUSTOMER LOCKABLE: SECURITY SECTOR NOT PROGRAMMED OR PROTECTED AT THE
FACTORY................................................................................................................................................... 37
TABLE 3. COMMAND DEFINITIONS......................................................................................................... 38
COMMON FLASH MEMORY INTERFACE (CFI) MODE .....................................................................................41
QUERY COMMAND AND COMMAND FLASH MEMORY INTERFACE (CFI) MODE............................... 41
Table 4-1. CFI mode: Identification Data Values (Note 1) ............................................................................... 41
Table 4-2. CFI mode: System Interface Data Values.................................................................................. 41
Table 4-3. CFI mode: Device Geometry Data Values................................................................................. 42
Table 4-4. CFI mode: Primary Vendor-Specific Extended Query Data Values ........................................... 43
ELECTRICAL CHARACTERISTICS ....................................................................................................................44
ABSOLUTE MAXIMUM STRESS RATINGS.............................................................................................. 44
OPERATING TEMPERATURE AND VOLTAGE ......................................................................................... 44
Maximum Negative Overshoot Waveform .................................................................................................. 44
Maximum Positive Overshoot Waveform.................................................................................................... 44
DC CHARACTERISTICS............................................................................................................................ 45
SWITCHING TEST CIRCUITS ................................................................................................................... 46
SWITCHING TEST WAVEFORMS............................................................................................................ 46
AC CHARACTERISTICS............................................................................................................................ 47
WRITE COMMAND OPERATION.........................................................................................................................48
Figure 4. COMMAND WRITE OPERATION............................................................................................... 48
READ/RESET OPERATION .................................................................................................................................49
Figure 5. READ TIMING WAVEFORMS..................................................................................................... 49
Figure 6. RESET# TIMING WAVEFORM .................................................................................................. 50
P/N:PM1509
REV. 1.5, OCT. 21, 2015
3
5秒后页面跳转
深入解析CS8416引脚说明、参数、技术特点
TPA3116D2功放芯片参数详解、引脚说明
移位寄存器74HC165引脚说明、驱动程序示例解读
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
