MURF1620CT
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
http://onsemi.com
• Ultrafast 35 Nanosecond Recovery Times
• 150°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
ULTRAFAST RECTIFIER
16 AMPERES, 200 VOLTS
• High Temperature Glass Passivated Junction
• Low Leakage Specified @ 150°C Case Temperature
• Current Derating @ Both Case and Ambient Temperatures
• Electrically Isolated. No Isolation Hardware Required.
• UL Recognized File #E69369 (Note 1)
1
2
3
• Pb−Free Package is Available*
MARKING
DIAGRAM
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.9 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
AYWW
U1620G
MAXIMUM RATINGS (Per Leg)
A K A
ISOLATED TO−220
Rating
Symbol
Value
Unit
CASE 221D
STYLE 3
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RWM
V
200
V
1
RRM
2
V
3
R
Average Rectified Forward Current
I
A
A
A
F(AV)
Total Device, (Rated V ), T = 150°C
8
R
C
Total Device
16
A
Y
= Assembly Location
= Year
Peak Repetitive Forward Current
I
16
FM
WW
= Work Week
(Rated V , Square Wave, 20 kHz),
R
U1620 = Device Code
T
C
= 150°C
G
AKA
= Pb−Free Package
= Diode Polarity
Non−repetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
I
100
FSM
ORDERING INFORMATION
Operating Junction and Storage Temperature T , T
− 65 to +150 °C
J
stg
RMS Isolation Voltage
V
V
iso1
Device
Package
Shipping
(t = 1 second, R.H. ≤ 30%, T = 25°C)
A
(Note 2) Per Figure 3
Per Figure 4 (Note 1)
Per Figure 5
4500
3500
1500
MURF1620CT
TO−220
50 Units/Rail
50 Units/Rail
V
iso2
V
iso3
MURF1620CTG
TO−220
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Preferred devices are recommended choices for future use
and best overall value.
1. UL Recognized mounting method is per Figure 4
2. Proper strike and creepage distance must be provided.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 5
MURF1620CT/D