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MURB1660CT PDF预览

MURB1660CT

更新时间: 2024-09-24 22:17:11
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
6页 110K
描述
ULTRAFAST RECTIFIER 16 AMPERES 600 VOLTS

MURB1660CT 数据手册

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Order this document  
by MURB1660CT/D  
SEMICONDUCTOR TECHNICAL DATA  
2
D PAK Power Surface Mount Package  
Motorola Preferred Device  
Designed for use in switching power supplies, inverters and as free wheeling  
diodes, these state–of–the–art devices have the following features:  
Package Designed for Power Surface Mount Applications  
Ultrafast 60 Nanosecond Recovery Times  
175°C Operating Junction Temperature  
ULTRAFAST RECTIFIER  
16 AMPERES  
600 VOLTS  
Epoxy Meets UL94, V @ 1/8″  
O
High Temperature Glass Passivated Junction  
High Voltage Capability to 600 V  
Low Leakage Specified @ 150°C Case Temperature  
Short Heat Sink Tab Manufactured – Not Sheared!  
Similar in Size to Industrial Standard TO–220 Package  
4
1
3
4
1
Mechanical Characteristics  
3
Case: Epoxy, Molded  
Weight: 1.7 grams (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
CASE 418B–02  
2
D PAK  
Lead and Mounting Surface Temperature for Soldering  
Purposes: 260°C Max. for 10 Seconds  
Shipped 50 units per plastic tube  
Available in 24 mm Tape and Reel, 800 units per reel by  
adding a “T4” suffix to the part number  
Marking: U1660T  
MAXIMUM RATING, PER LEG  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
600  
Volts  
RRM  
RWM  
R
V
Average Rectified Forward Current  
I
8
16  
Amps  
Amps  
Amps  
°C  
F(AV)  
Total Device, (Rated V ), T = 150°C  
Total Device  
R
C
Peak Repetitive Forward Current  
I
16  
FM  
(Rated V , Square Wave, 20 kHz), T = 150°C  
R
C
Non–repetitive Peak Surge Current  
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)  
I
FSM  
100  
Operating Junction and Storage Temperature  
T , T  
J
– 65 to +175  
stg  
THERMAL CHARACTERISTICS, PER LEG  
Maximum Thermal Resistance, Junction to Case  
R
R
2
°C/W  
°C/W  
°C  
θJC  
Maximum Thermal Resistance, Junction to Ambient (1)  
50  
θJA  
Temperature for Soldering  
Purposes: 1/8from Case for 5 Seconds  
T
260  
L
(1) See Chapter 7 for mounting conditions  
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit  
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.  
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.  
Thermal Clad is a trademark of the Bergquist Company  
Preferred devices are Motorola recommended choices for future use and best overall value.  
Rev 1  
Motorola, Inc. 1996  

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