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MTP55N06Z PDF预览

MTP55N06Z

更新时间: 2024-02-07 07:13:45
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
6页 146K
描述
TMOS POWER FET 55 AMPERES 60 VOLTS RDS(on) = 18 mohm

MTP55N06Z 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.32
其他特性:ESD PROTECTED雪崩能效等级(Eas):454 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):55 A
最大漏极电流 (ID):55 A最大漏源导通电阻:0.016 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):238 pF
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e0元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
功耗环境最大值:136 W最大功率耗散 (Abs):136 W
最大脉冲漏极电流 (IDM):165 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):484 ns最大开启时间(吨):368 ns
Base Number Matches:1

MTP55N06Z 数据手册

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Order this document  
by MTP55N06Z/D  
SEMICONDUCTOR TECHNICAL DATA  
N–Channel Enhancement–Mode Silicon Gate  
TMOS POWER FET  
This advanced high voltage TMOS E–FET is designed to  
withstand high energy in the avalanche mode and switch efficiently.  
This new high energy device also offers a drain–to–source diode  
with fast recovery time. Designed for high voltage, high speed  
switching applications in power supplies, PWM motor controls and  
other inductive loads, the avalanche energy capability is specified  
to eliminate the guesswork in designs where inductive loads are  
switched and offer additional safety margin against unexpected  
voltage transients.  
55 AMPERES  
60 VOLTS  
R
= 18 m  
DS(on)  
Avalanche Energy Capability Specified at Elevated  
Temperature  
Source–to–Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
Low Stored Gate Charge for Efficient Switching  
Internal Source–to–Drain Diode Designed to Replace External  
Zener Transient Suppressor–Absorbs High Energy in the  
Avalanche Mode  
ESD Protected. Designed to Typically Withstand 400 V  
Machine Model and 4000 V Human Body Model.  
D
S
G
CASE 221A–06, Style 5  
TO–220AB  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Drain–to–Source Voltage  
V
DSS  
Drain–to–Gate Voltage (R  
GS  
= 1.0 M)  
V
DGR  
60  
Gate–to–Source Voltage — Continuous  
Gate–to–Source Voltage — Non–Repetitive (t 10 ms)  
V
± 20  
± 40  
Vdc  
Vpk  
GS  
V
GSM  
p
Drain Current — Continuous @ T = 25°C  
I
I
55  
35.5  
165  
Adc  
Apk  
C
D
D
Drain Current — Continuous @ T = 100°C  
C
Drain Current — Single Pulse (t 10 µs)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
113  
0.91  
Watts  
W/°C  
C
Operating and Storage Temperature Range  
T , T  
stg  
55 to 150  
454  
°C  
J
Single Pulse Drain–to–Source Avalanche Energy — Starting T = 25°C  
E
AS  
mJ  
J
(V  
DD  
= 25 Vdc, V  
= 60 Vdc, V  
= 10 Vdc, Peak I = 55 Apk, L = 0.3 mH, R = 25 )  
GS L G  
DS  
Thermal Resistance — Junction–to–Case  
Thermal Resistance — Junction–to–Ambient  
R
R
1.1  
62.5  
°C/W  
°C  
θJC  
θJA  
Maximum Lead Temperature for Soldering Purposes, 1/8from case for 10 seconds  
T
260  
L
This document contains information on a new product. Specifications and information herein are subject to change without notice.  
E–FET is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.  
REV 1  
Motorola, Inc. 1997  

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