Datasheet > MT55L128L32P1B-10

MT55L128L32P1B-10

更新时间： 2023-01-02 16:06:10

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器
页数	文件大小	规格书
31页	269K
描述
ZBT SRAM, 128KX32, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

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MT55L128L32P1B-10 数据手册

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4Mb : 256K x 18, 128K x 32/36

PIPELINED ZBT SRAM

MT55L256L18P1, MT55L256V18P1,

MT55L128L32P1, MT55L128V32P1,

MT55L128L36P1, MT55L128V36P1

4Mb

ZBT^®SRAM

3.3V VDD, 3.3V o r 2.5V I/O

FEATURES

100-Pin TQFP

• High frequen cy an d 100 percen t bus utilization

• Fast cycle tim es: 6n s, 7.5n s an d 10n s

• Sin gle +3.3V ±5% power supply (VDD)

• Separate +3.3V or +2.5V isolated output buffer

supply (VDDQ)

• Advan ced con trol logic for m in im um con trol

sign al in terface

• Individual BYTE WRITE controls m ay be tied LOW

• Sin gle R/W# (read/write) con trol pin

• CKE# pin to en able clock an d suspen d operation s

• Th ree ch ip en ables for sim ple depth expan sion

• Clock-con trolled an d registered addresses, data

I/Os an d con trol sign als

• In tern ally self-tim ed, fully coh eren t WRITE

• In tern ally self-tim ed, registered outputs to

elim in ate th e n eed to con trol OE#

• SNOOZE MODE for reduced-power stan dby

• Com m on data in puts an d data outputs

• Lin ear or in terleaved burst m odes

• Burst feature (option al)

165-Pin FBGA

(Preliminary Package Data)

• Pin /fun ction com patibility with 2Mb, 8Mb, an d

16Mb ZBT SRAM fam ily

• Autom atic power-down

• 165-pin FBGA package

• 100-pin TQFP package

• 119-pin BGA package

OPTIONS

MARKING

• Tim in g (Access/Cycle/MHz)

3.5n s/6n s/166 MHz

4.2n s/7.5n s/133 MHz

5n s/10n s/100 MHz

• Con figuration s

3.3V I/O

-6

-7.5

-10

119-Pin BGA

256K x 18

128K x 32

128K x 36

MT55L256L18P1

MT55L128L32P1

MT55L128L36P1

2.5V I/O

256K x 18

128K x 32

128K x 36

MT55L256V18P1

MT55L128V32P1

MT55L128V36P1

• Package

100-pin TQFP

165-pin FBGA

119-pin , 14m m x 22m m BGA

• Operatin g Tem perature Ran ge

Com m ercial (0°C to +70°C)

In dustrial (-40°C to +85°C)**

Part Number Example:

NOTE: 1. JEDEC-standard MS-026 BHA (LQFP).

2. JEDEC-standard MS-028 BHA(PBGA).

Non e

* A Part Markin g Guide for th e FBGA devices can be foun d on Micron ’s

Web site—h ttp://www.m icron .com /support/in dex.h tm l.

** In dustrial tem perature ran ge offered in specific speed grades an d

con figuration s. Con tact factory for m ore in form ation .

MT55L256L18P1T-10

4Mb: 256K x 18, 128K x 32/36 Pipelined ZBT SRAM

MT55L256L18P1_D.p65 – Rev. 10/01

Micron Technology, Inc., reservesthe right to change productsor specificationswithout notice.

12 3 4 5 6 7...31

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