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MSP430F2013IRSAT

更新时间： 2024-02-04 23:39:06

品牌	Logo	应用领域
德州仪器 - TI		微控制器
页数	文件大小	规格书
88页	2460K
描述
MIXED SIGNAL MICROCONTROLLER

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MSP430F2013IRSAT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	QFN-16	针数：	16
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.31.00.01	Factory Lead Time：	1 week
风险等级：	0.72	Is Samacsys：	N
具有ADC：	YES	其他特性：	IT ALSO OPERATES AT 1.8 V AT 6 MHZ
地址总线宽度：		位大小：	16
边界扫描：	YES	CPU系列：	MSP430
最大时钟频率：	16 MHz	DAC 通道：	NO
DMA 通道：	NO	外部数据总线宽度：
格式：	FIXED POINT	集成缓存：	NO
JESD-30 代码：	S-PQCC-N16	JESD-609代码：	e4
长度：	4 mm	低功率模式：	YES
湿度敏感等级：	2	DMA 通道数量：
I/O 线路数量：	10	串行 I/O 数：
端子数量：	16	计时器数量：	2
片上数据RAM宽度：	8	片上程序ROM宽度：	8
最高工作温度：	105 °C	最低工作温度：	-40 °C
PWM 通道：	YES	封装主体材料：	PLASTIC/EPOXY
封装代码：	HVQCCN	封装等效代码：	LCC16,.16SQ,25
封装形状：	SQUARE	封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260	电源：	2/3.3 V
认证状态：	Not Qualified	RAM（字节）：	128
RAM（字数）：	0.125	ROM（单词）：	2048
ROM可编程性：	FLASH	座面最大高度：	1 mm
速度：	16 MHz	子类别：	Microcontrollers
最大压摆率：	0.37 mA	最大供电电压：	3.6 V
最小供电电压：	1.8 V	标称供电电压：	2.2 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	NO LEAD	端子节距：	0.65 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	4 mm	uPs/uCs/外围集成电路类型：	MICROCONTROLLER, RISC
Base Number Matches：	1

MSP430F2013IRSAT 数据手册

MSP430x20x1, MSP430x20x2, MSP430x20x3

MIXED SIGNAL MICROCONTROLLER

SLAS491D -- AUGUST 2005 -- REVISED SEPTEMBER 2007

Low Supply Voltage Range 1.8 V to 3.6 V

Brownout Detector

Ultralow Power Consumption

-- Active Mode: 220 μA at 1 MHz, 2.2 V

-- Standby Mode: 0.5 μA

Serial Onboard Programming,

No External Programming Voltage Needed

Programmable Code Protection by

Security Fuse

-- Off Mode (RAM Retention): 0.1 μA

Five Power-Saving Modes

On-Chip Emulation Logic With Spy-Bi-Wire

Interface

Ultrafast Wake-Up From Standby Mode in

Less Than 1 μs

Family Members Include:

MSP430F2001: 1KB + 256B Flash Memory

128B RAM

MSP430F2011: 2KB + 256B Flash Memory

128B RAM

MSP430F2002: 1KB + 256B Flash Memory

128B RAM

MSP430F2012: 2KB + 256B Flash Memory

128B RAM

MSP430F2003: 1KB + 256B Flash Memory

128B RAM

MSP430F2013: 2KB + 256B Flash Memory

128B RAM

Available in a 14-Pin Plastic Small-Outline

Thin Package (TSSOP), 14-Pin Plastic Dual

Inline Package (PDIP), and 16-Pin QFN

For Complete Module Descriptions, See the

MSP430x2xx Family User’s Guide

16-Bit RISC Architecture, 62.5 ns

Instruction Cycle Time

Basic Clock Module Configurations:

-- Internal Frequencies up to 16 MHz With

Four Calibrated Frequencies to ±1%

-- Internal Very Low Power LF Oscillator

-- 32-kHz Crystal

-- External Digital Clock Source

16-Bit Timer_A With Two Capture/Compare

Registers

On-Chip Comparator for Analog Signal

Compare Function or Slope A/D

(MSP430x20x1 only)

10-Bit 200-ksps A/D Converter With Internal

Reference, Sample-and-Hold, and Autoscan

(MSP430x20x2 only)

16-Bit Sigma-Delta A/D Converter With

Differential PGA Inputs and Internal

Reference (MSP430x20x3 only)

Universal Serial Interface (USI) Supporting

SPI and I2C

(MSP430x20x2 and MSP430x20x3 only)

description

The Texas Instruments MSP430 family of ultralow-power microcontrollers consist of several devices featuring

different sets of peripherals targeted for various applications. The architecture, combined with five low-power

modes is optimized to achieve extended battery life in portable measurement applications. The device features

a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code

efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less

than 1μs.

The MSP430x20xx series is an ultralow-power mixed signal microcontroller with a built-in 16-bit timer, and ten

I/O pins. In addition the MSP430x20x1 has a versatile analog comparator. The MSP430x20x2 and

MSP430x20x3 have built-in communication capability using synchronous protocols (SPI or I2C), and a 10-bit

A/D converter (MSP430x20x2) or a 16-bit sigma-delta A/D converter (MSP430x20x3).

Typicalapplications include sensor systems thatcaptureanalog signals, convertthemto digitalvalues, andthen

process the data for display or for transmission to a host system. Stand alone RF sensor front end is another

area of application.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

12 3 4 5 6 7...88

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