Datasheet > MSB302

MSB302

更新时间： 2024-02-26 01:15:01

品牌	Logo	应用领域
松钜 - BYTESONIC		/
页数	文件大小	规格书
3页	1013K
描述
SINGLE PHASE 3.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS

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中文翻译

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技术参数
数据手册

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MSB302 技术参数

Package：	MSB	Maximum recurrent peak reverse voltage：	100
Maximum average forward rectified current：	2	Peak forward surge current：	80
Maximum instantaneous forward voltage：	1.1	Maximum reverse current：	10
TJ(℃）：	-55~150

MSB302 数据手册

MSB301~MSB307

Suggested Soldering Temperature Profile

Note

phase oven, hot air oven, wave solder.

Recom m ended reflow m ethods: IR, vapor

The device can be exposed to a m axim um tem perature of 265°C for 10 seconds.

industry m ethods and solvents.

Devices can be cleaned using standard

If reflow temperatures exceed the

perform ance requirem ents.

recom m ended profile, devices m ay not m eet the

Package Information

Carrier Dimension(mm)

1.55

1.75

6.90

1.65

8.60

7.50

Tolerance

12.0

2.0

4.0

0.30

0.1

Package Specifications

Box Size

(mm)

QTY/Box

(Kpcs)

Q'TY/Carton

(Kpcs)

Carton Size

(mm)

Q'TY/Reel

(Kpcs)

Reel DIA.

(mm)

Package

Reel Size

13'

338

MSBL

330

365*365*360

http://www

.bytesonic.com

.tw/

Version 1.1

2020/5/8

1 23

中文翻译

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