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MQSMBJ14ATR PDF预览

MQSMBJ14ATR

更新时间: 2024-11-20 04:47:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管
页数 文件大小 规格书
4页 182K
描述
Trans Voltage Suppressor Diode, 600W, 14V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AA, PLASTIC PACKAGE-2

MQSMBJ14ATR 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DO-214AA包装说明:PLASTIC PACKAGE-2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.36最大击穿电压:17.2 V
最小击穿电压:15.6 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
JESD-609代码:e0湿度敏感等级:1
最大非重复峰值反向功率耗散:600 W元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:1.38 W认证状态:Not Qualified
最大重复峰值反向电压:14 V表面贴装:YES
技术:AVALANCHE端子面层:TIN LEAD
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

MQSMBJ14ATR 数据手册

 浏览型号MQSMBJ14ATR的Datasheet PDF文件第2页浏览型号MQSMBJ14ATR的Datasheet PDF文件第3页浏览型号MQSMBJ14ATR的Datasheet PDF文件第4页 
SMBJ5.0 thru SMBJ170A, CA, e3  
and SMBG5.0 thru SMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W  
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive  
components from destruction or degradation. It is available in J-bend design  
(SMBJ) with the DO-214AA package for greater PC board mounting density or  
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.  
It is also available in both unidirectional and bidirectional configurations with a  
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their  
response time is virtually instantaneous. As a result, they can be used for  
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for  
inductive switching environments and induced RF protection. They can also  
protect from secondary lightning effects per IEC61000-4-5 and class levels  
defined herein. Microsemi also offers numerous other TVS products to meet  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
higher and lower power demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Available in both unidirectional and bidirectional  
Economical surface mount design in both J-bend or  
Gull-wing terminations  
construction (add C or CA suffix for bidirectional)  
Selections for 5.0 to 170 volts standoff voltages (VWM  
)
Protects sensitive components such as IC’s, CMOS,  
Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
Optional 100% screening for avionics grade is available  
by adding MA prefix to part number for 100% temperature  
cycle -55oC to +125oC (10X) as well as surge (3X) and 24  
hours HTRB with post test VZ & IR (in operating direction  
for unidirectional or both directions for bidirectional)  
Protection from switching transients & induced RF  
Compliant to IEC61000-4-2 and IEC61000-4-4 for  
ESD and EFT protection respectively  
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
Options for screening in accordance with MIL-PRF-19500  
for JAN, JANTX, and JANTXV by adding MQ, MX, or MV  
prefixes respectively to part numbers.  
Class 1: SMB 5.0 to SMB 120A or CA  
Class 2: SMB 5.0 to SMB 60A or CA  
Class 3: SMB 5.0 to SMB 30A or CA  
Class 4: SMB 5.0 to SMB 15A or CA  
Axial-lead equivalent packages for thru-hole mounting  
available as P6KE6.8 to P6KE200CA (consult factory for  
other surface mount options)  
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
Moisture classification is Level 1 with no dry pack required  
per IPC/JEDEC J-STD-020B  
Class 1: SMB 5.0 to SMB 36A or CA  
Class 2: SMB 5.0 to SMB 18A or CA  
RoHS compliant devices available by adding an “e3” suffix  
MAXIMUM RATINGS  
Peak Pulse Power dissipation at 25ºC: 600 watts at  
10/1000 μs (also see Fig 1,2, and 3).  
MECHANICAL AND PACKAGING  
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
Impulse repetition rate (duty factor): 0.01%  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
tin-lead or RoHS compliant annealed matte-tin plating  
solderable per MIL-STD-750, method 2026  
tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65ºC to +150ºC  
POLARITY: Cathode indicated by band. No marking  
on bi-directional devices  
Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W  
junction to ambient when mounted on FR4 PC board (1oz  
Cu) with recommended footprint (see last page)  
MARKING: Part number without standard prefix (e.g.  
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)  
Steady-State Power dissipation: 5 watts at TL = 25oC, or  
1.38 watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint  
TAPE & REEL option: Standard per EIA-481-1-A with  
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
WEIGHT: 0.1 grams  
Forward Surge at 25ºC: 100 Amps peak impulse of 8.3  
See package dimension on last page  
ms half-sine wave (unidirectional only)  
Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright © 2007  
6-20-2007 REV H  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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