MPSW01G

更新时间： 2024-01-23 04:55:39

品牌	Logo	应用领域
安森美 - ONSEMI		晶体小信号双极晶体管
页数	文件大小	规格书
4页	129K
描述
One Watt High Current Transistors NPN Silicon

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技术参数
数据手册

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MPSW01G 技术参数

生命周期：	Obsolete	包装说明：	CYLINDRICAL, O-PBCY-T3
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8541.29.00.75	风险等级：	5.3
最大集电极电流 (IC)：	1 A	基于收集器的最大容量：	20 pF
集电极-发射极最大电压：	30 V	配置：	SINGLE
最小直流电流增益 (hFE)：	50	JEDEC-95代码：	TO-92
JESD-30 代码：	O-PBCY-T3	元件数量：	1
端子数量：	3	最高工作温度：	150 °C
封装主体材料：	PLASTIC/EPOXY	封装形状：	ROUND
封装形式：	CYLINDRICAL	极性/信道类型：	NPN
功耗环境最大值：	2.5 W	认证状态：	Not Qualified
表面贴装：	NO	端子形式：	THROUGH-HOLE
端子位置：	BOTTOM	晶体管元件材料：	SILICON
标称过渡频率 (fT)：	50 MHz	VCEsat-Max：	0.5 V
Base Number Matches：	1

MPSW01G 数据手册

MPSW01, MPSW01A

One Watt High Current

Transistors

NPN Silicon

Features

http://onsemi.com

• Pb−Free Packages are Available*

COLLECTOR

MAXIMUM RATINGS

BASE

Rating

Symbol

Value

Unit

Collector−Emitter Voltage

CEO

CBO

EBO

Vdc

MPSW01

EMITTER

MPSW01A

Collector−Base Voltage

Vdc

MPSW01

MPSW01A

Emitter−Base Voltage

5.0

Vdc

Collector Current − Continuous

1000

mAdc

Total Device Dissipation @ T = 25°C

1.0

8.0

mW/°C

Derate above 25°C

Total Device Dissipation @ T = 25°C

2.5

mW/°C

Derate above 25°C

TO−92 (TO−226AE)

CASE 29−10

STYLE 1

Operating and Storage Junction

Temperature Range

T , T

−55 to +150

°C

stg

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

125

Unit

°C/W

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

MARKING DIAGRAM

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

MPS

W01x

AYWWG

= 01A Devices

= Assembly Location

= Year

WW = Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

February, 2010 − Rev. 5

MPSW01/D

12 3 4

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