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MPSA12RLRP PDF预览

MPSA12RLRP

更新时间: 2024-02-26 02:54:46
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号双极晶体管达林顿晶体管
页数 文件大小 规格书
3页 48K
描述
Darlington Transistors NPN Silicon

MPSA12RLRP 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:,Reach Compliance Code:not_compliant
风险等级:5.76JESD-609代码:e0
峰值回流温度(摄氏度):NOT SPECIFIED端子面层:Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

MPSA12RLRP 数据手册

 浏览型号MPSA12RLRP的Datasheet PDF文件第2页浏览型号MPSA12RLRP的Datasheet PDF文件第3页 
MPSA12  
Darlington Transistors  
NPN Silicon  
Features  
Pb−Free Packages are Available*  
http://onsemi.com  
COLLECTOR 3  
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
Emitter Base Voltage  
Symbol  
Value  
20  
Unit  
Vdc  
Vdc  
BASE  
V
CES  
EBO  
2
V
10  
Total Device Dissipation @ T = 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
Derate above 25°C  
EMITTER 1  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
MARKING  
DIAGRAM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
200  
°C/W  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
MPS  
A12  
AYWW G  
TO−92  
CASE 29−11  
STYLE 1  
G
1
2
3
R
S
MPSA12 = Device Code  
i
n
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
e
n
IDEAL  
TRANSISTOR  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MPSA12  
TO−92  
5,000 Units/Box  
5,000 Units/Box  
MPSA12G  
TO−92  
(Pb−Free)  
Figure 1. Transistor Noise Model  
MPSA12RLRA  
TO−92  
2,000/Tape & Reel  
2,000/Tape & Reel  
MPSA12RLRAG  
TO−92  
(Pb−Free)  
MPSA12RLRP  
TO−92  
2,000/Tape & Reel  
2,000/Tape & Reel  
MPSA12RLRPG  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 1  
MPSA12/D  

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