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MPC8321CVRADDCA PDF预览

MPC8321CVRADDCA

更新时间: 2024-10-02 14:59:27
品牌 Logo 应用领域
恩智浦 - NXP PC双倍数据速率
页数 文件大小 规格书
82页 1309K
描述
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz e300, QE, PCI, USB2.0, DDR1/2, UART, -40-105C

MPC8321CVRADDCA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, PBGA-516针数:516
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.25
地址总线宽度:位大小:32
边界扫描:YES最大时钟频率:66.67 MHz
外部数据总线宽度:格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B516
JESD-609代码:e2长度:27 mm
低功率模式:YES湿度敏感等级:3
端子数量:516封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:2.55 mm
速度:266 MHz最大供电电压:1.05 V
最小供电电压:0.95 V标称供电电压:1 V
表面贴装:YES技术:CMOS
端子面层:TIN COPPER/TIN SILVER端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:27 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

MPC8321CVRADDCA 数据手册

 浏览型号MPC8321CVRADDCA的Datasheet PDF文件第2页浏览型号MPC8321CVRADDCA的Datasheet PDF文件第3页浏览型号MPC8321CVRADDCA的Datasheet PDF文件第4页浏览型号MPC8321CVRADDCA的Datasheet PDF文件第5页浏览型号MPC8321CVRADDCA的Datasheet PDF文件第6页浏览型号MPC8321CVRADDCA的Datasheet PDF文件第7页 
Document Number: MPC8323EEC  
Rev. 4, 09/2010  
Freescale Semiconductor  
Technical Data  
MPC8323E  
PowerQUICC II Pro Integrated  
Communications Processor  
Family Hardware Specifications  
Contents  
This document provides an overview of the MPC8323E  
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
PowerQUICC II Pro processor features. The MPC8323E is a  
cost-effective, highly integrated communications processor  
that addresses the requirements of several networking  
applications, including ADSL SOHO and residential  
gateways, modem/routers, industrial control, and test and  
measurement applications. The MPC8323E extends current  
PowerQUICC offerings, adding higher CPU performance,  
additional functionality, and faster interfaces, while  
addressing the requirements related to time-to-market, price,  
power consumption, and board real estate. This document  
describes the MPC8323E, and unless otherwise noted, the  
information also applies to the MPC8323, MPC8321E, and  
MPC8321.  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 9  
4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 11  
6. DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . 13  
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
8. Ethernet and MII Management . . . . . . . . . . . . . . . . . 19  
9. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
10. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
11. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
12. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35  
13. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
15. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
16. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
17. TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
18. UTOPIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
19. HDLC, BISYNC, Transparent, and Synchronous  
To locate published errata or updates for this document, refer  
to the MPC8323E product summary page on our website  
listed on the back cover of this document or contact your  
local Freescale sales office.  
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
20. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
21. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49  
22. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
23. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71  
24. System Design Information . . . . . . . . . . . . . . . . . . . 76  
25. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 79  
26. Document Revision History . . . . . . . . . . . . . . . . . . . 80  
© 2010 Freescale Semiconductor, Inc. All rights reserved.  

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