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MPC5602DXLL PDF预览

MPC5602DXLL

更新时间: 2024-01-21 09:43:07
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 闪存控制器
页数 文件大小 规格书
77页 675K
描述
Up to 256 KB on-chip Code Flash supported with Flash controller and ECC

MPC5602DXLL 技术参数

生命周期:Transferred零件包装代码:QFP
包装说明:LFQFP,针数:100
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.64具有ADC:YES
其他特性:ALSO OPERATES AT 3 V MINIMUM SUPPLY地址总线宽度:
位大小:32最大时钟频率:16 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PQFP-G100
长度:14 mmI/O 线路数量:79
端子数量:100最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
认证状态:Not QualifiedROM可编程性:FLASH
座面最大高度:1.7 mm速度:48 MHz
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD宽度:14 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

MPC5602DXLL 数据手册

 浏览型号MPC5602DXLL的Datasheet PDF文件第1页浏览型号MPC5602DXLL的Datasheet PDF文件第2页浏览型号MPC5602DXLL的Datasheet PDF文件第4页浏览型号MPC5602DXLL的Datasheet PDF文件第5页浏览型号MPC5602DXLL的Datasheet PDF文件第6页浏览型号MPC5602DXLL的Datasheet PDF文件第7页 
Introduction  
1
Introduction  
1.1  
Document overview  
This document describes the device features and highlights the important electrical and physical characteristics.  
1.2  
Description  
These 32-bit automotive microcontrollers are a family of system-on-chip (SoC) devices designed to be central to the  
development of the next wave of central vehicle body controller, smart junction box, front module, peripheral body, door control  
and seat control applications.  
This family is one of a series of next-generation integrated automotive microcontrollers based on the Power Architecture  
technology and designed specifically for embedded applications.  
The advanced and cost-efficient e200z0 host processor core of this automotive controller family complies with the Power  
Architecture technology and only implements the VLE (variable-length encoding) APU (auxiliary processing unit), providing  
improved code density. It operates at speeds of up to 48 MHz and offers high performance processing optimized for low power  
consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported  
with software drivers, operating systems and configuration code to assist with the user’s implementations.  
The device platform has a single level of memory hierarchy and can support a wide range of on-chip static random access  
memory (SRAM) and internal flash memory.  
Table 1. MPC5602D device comparison  
Device  
Feature  
MPC5601DxLH  
MPC5601DxLL  
MPC5602DxLH  
e200z0  
MPC5602DxLL  
CPU  
Execution speed  
Code Flash  
Data Flash  
SRAM  
Static – up to 48 MHz  
64 KB (4 × 16 KB)  
16 ch  
128 KB  
12 KB  
256 KB  
16 KB  
eDMA  
ADC  
16 ch, 12-bit  
13 ch, 16-bit  
33 ch, 12-bit  
16 ch, 12-bit  
33 ch, 12-bit  
28 ch, 16-bit  
CTU  
16 ch  
Total timer I/O1  
eMIOS  
28 ch, 16-bit  
13 ch, 16-bit  
Type X2  
Type Y3  
2 ch  
5 ch  
9 ch  
7 ch  
7 ch  
2 ch  
5 ch  
9 ch  
7 ch  
7 ch  
Type G4  
Type H5  
SCI (LINFlex)  
SPI (DSPI)  
CAN (FlexCAN)  
GPIO6  
7 ch  
4 ch  
7 ch  
4 ch  
3
2
1
45  
79  
45  
79  
MPC5602D Microcontroller Data Sheet, Rev. 3.1  
Preliminary—Subject to Change Without Notice  
Freescale Semiconductor  
3

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