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MPA20162R2MBE PDF预览

MPA20162R2MBE

更新时间: 2024-04-09 18:57:59
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
10页 978K
描述
Multilayer Ferrite Power Inductor (AEC-Q200) / MPA Series 2.2, 1100mA

MPA20162R2MBE 数据手册

 浏览型号MPA20162R2MBE的Datasheet PDF文件第4页浏览型号MPA20162R2MBE的Datasheet PDF文件第5页浏览型号MPA20162R2MBE的Datasheet PDF文件第6页浏览型号MPA20162R2MBE的Datasheet PDF文件第7页浏览型号MPA20162R2MBE的Datasheet PDF文件第8页浏览型号MPA20162R2MBE的Datasheet PDF文件第9页 
Test item  
Test condition  
Criteria  
1. No mechanical damage  
2. Inductance value should be  
within ± 30 % of the initial value  
* Apply DC 0.4 ~ 0.6A to chip for  
1 ~ 3 sec. before to measure  
inductance.  
5g's for 20 minutes,12cycles each of 3  
orientations  
Test from 10-2000Hz.,12cycles each of 3  
orientations  
Vibration Test  
1. More than 95 % of terminal  
electrode should be covered with  
new solder  
2. No mechanical damage  
3. Inductance value should be  
within ± 20% of the initial value  
1.Solder temperature : 260 ± 5℃  
2.Flux : Rosin  
3.DIP time : 10 ± 1 sec  
Resistance to Solder  
Heat  
* Apply DC 0.4 ~ 0.6A to chip for  
1 ~ 3 sec. before to measure  
inductance  
.
1. No mechanical damage  
2. Inductance value should be  
within ± 30 % of the initial value  
Classification Levels 1C  
1000 V (DC) to < 2000 V (DC)  
* Apply DC 0.4 ~ 0.6A to chip for  
1 ~ 3 sec. before to measure  
inductance.  
ESD  
1.More than 95 % of terminal  
electrode should be covered with  
new solder  
1.Solder temperature : 235 ± 5℃  
2.Flux : Rosin  
3.DIP time : 5 ± 1 sec  
Solderability Test  
Board Flex  
2.No mechanical damage  
Epoxy-PCB(1.6mm)  
No mechanical damage.  
Deflection 2mm(min)  
60s minimum holding time  
Size Apply Force(F) Test Time  
No mechanical damage.  
Terminal Strength  
2012  
17.7 N  
60 +1 sec.  
Page 10 of 10  

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