MP86962 – 80A INTELLI-PHASETM SOLUTION IN A TLGA-41 PACKAGE
Thermal Resistance (4) θJB θJC_TOP
TLGA-41 (5mmx6mm)..........2.7..... 12.4... °C/W
(1)
ABSOLUTE MAXIMUM RATINGS
Supply voltage (VIN) .....................................18V
VIN - VPHASE (DC).......................... -0.3V to +25V
VIN - VPHASE (10ns)........................... -5V to +32V
VSW (DC)...............................-0.3V to VIN + 0.3V
VSW (25ns) ...................................... -5V to +25V
VBST .....................................................VSW + 4V
VBST - VPHASE .................................. -0.3V to +4V
VDD, VDRV........................................ -0.3V to +4V
All other pins........................-0.3V to VDD + 0.3V
Instantaneous current................................125A
Junction temperature...............................150°C
Lead temperature ....................................260°C
Storage temperature................-65°C to +150°C
Notes:
1) Exceeding these ratings may damage the device.
2) Followed ANSI/ESDA/JEDEC JS-001 for HBM and
ANSI/ESDA/JEDEC JS-002 for CDM.
3) The device is not guaranteed to function outside of its operating
conditions.
4) θJB: Thermal resistance from the junction to the board around
the PGND soldering point.
θJC_TOP: Thermal resistance from the junction to the top of the
package.
ESD Ratings (2)
Human body model (HBM) ..................Class 1C
Charged device model (CDM)........... Class C2B
Recommended Operating Conditions (3)
Supply voltage (VIN) ........................... 3V to 16V
Driver voltage (VDRV)......................... 3V to 3.6V
Logic voltage (VDD)............................ 3V to 3.6V
Operating junction temp (TJ) ....-40°C to +125°C
MP86962 Rev. 1.0
8/24/2022
MonolithicPower.com
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