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MP86961DU-LF-Z PDF预览

MP86961DU-LF-Z

更新时间: 2024-01-26 02:34:31
品牌 Logo 应用领域
芯源 - MPS 驱动接口集成电路
页数 文件大小 规格书
11页 409K
描述
Half Bridge Based Peripheral Driver,

MP86961DU-LF-Z 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.83
接口集成电路类型:HALF BRIDGE BASED PERIPHERAL DRIVERJESD-609代码:e3
湿度敏感等级:1峰值回流温度(摄氏度):260
端子面层:Matte Tin (Sn)处于峰值回流温度下的最长时间:40
Base Number Matches:1

MP86961DU-LF-Z 数据手册

 浏览型号MP86961DU-LF-Z的Datasheet PDF文件第1页浏览型号MP86961DU-LF-Z的Datasheet PDF文件第3页浏览型号MP86961DU-LF-Z的Datasheet PDF文件第4页浏览型号MP86961DU-LF-Z的Datasheet PDF文件第5页浏览型号MP86961DU-LF-Z的Datasheet PDF文件第6页浏览型号MP86961DU-LF-Z的Datasheet PDF文件第7页 
MP86961 –20A, 27V INTELLI-PHASESOLUTION INTEGRATED HS/LS FETS AND DRIVER IN A 5X5mm QFN  
ORDERING INFORMATION  
Part Number*  
Package  
Top Marking  
Free Air Temperature(TA)  
MP86961DU  
5x5 QFN  
86961DU  
-40°C to +85°C  
* For Tape & Reel, add suffix –Z (e.g. MP86961DU–Z);  
For RoHS compliant packaging, add suffix –LF (e.g. MP86961DU–LF–Z)  
PACKAGE REFERENCE  
PIN 1 ID  
1
18 GND  
17 GND  
N/C  
VCC  
AGND  
EN  
IN  
IN  
IN  
IN  
GND  
GND  
GND  
GND  
2
SW  
SW  
SW  
SW  
3
4
5
6
7
8
9
16  
GND  
15  
GND  
14  
GND  
SYNC  
PWM  
PG  
13  
GND  
12  
GND  
11  
GND  
BST  
IN  
10  
GND  
EXPOSED PAD  
CONNECT TO PIN  
Thermal Resistance (4)  
5x5 QFN .................................36....... 8.... °C/W  
θJA  
θJC  
ABSOLUTE MAXIMUM RATINGS (1)  
Supply Voltage VIN ....................................... 27V  
V
SW………………………………………..-0.3V (-3V for  
Notes:  
1) Exceeding these ratings may damage the device.  
2) The maximum allowable power dissipation is a function of the  
maximum junction temperature TJ(MAX), the junction-to-  
ambient thermal resistance θJA, and the ambient temperature  
TA. The maximum allowable continuous power dissipation at  
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-  
TA)/ θJA. Exceeding the maximum allowable power dissipation  
will cause excessive die temperature.  
<20ns) …………………….to VIN + 0.3V (+3V  
for <20ns)  
VBST ......................................................VSW + 6V  
All Other Pins..................................-0.3V to +6V  
(2)  
Continuous Power Dissipation (TA = +25°C)  
............................................................. 3.5W  
Junction Temperature...............................150°C  
Lead Temperature ....................................260°C  
Storage Temperature............... -65°C to +150°C  
3) The device is not guaranteed to function outside of its  
operating conditions.  
4) Measured on approximately 4” square of 4-layer PCB.  
Recommended Operating Conditions (3)  
Supply Voltage VIN ...........................4.5V to 21V  
VCC Driver Voltage …………………4.5V to 5.5V  
Operating Junct. Temp (TJ)...... -40°C to +125°C  
MP86961 Rev. 1.22  
12/26/2013  
www.MonolithicPower.com  
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.  
© 2013 MPS. All Rights Reserved.  
2

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