MP4688DN-Z

更新时间： 2024-01-24 16:35:51

品牌	Logo	应用领域
芯源 - MPS		驱动器
页数	文件大小	规格书
11页	477K
描述
LED Driver, 1-Segment, PDSO8, MS-012BA, SOIC-8

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MP4688DN-Z 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	SOIC
包装说明：	SOIC-8	针数：	8
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.07
接口集成电路类型：	LED DISPLAY DRIVER	JESD-30 代码：	R-PDSO-G8
长度：	4.9 mm	功能数量：	1
区段数：	1	端子数量：	8
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	HLSOP
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
座面最大高度：	1.7 mm	最大供电电压：	75 V
最小供电电压：	4.5 V	标称供电电压：	12 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.9 mm	Base Number Matches：	1

MP4688 – 80V INPUT, 1A HIGH POWER LED DRIVER

PIN FUNCTIONS

SOIC8E SOIC8

Name

Description

Pin #

Feedback. This is the input to hysteretic comparators. An external current sensing

resistor is connected in series with the LEDs to GND. The feedback voltage is

connected to this pin and is regulated at +200mV with 15% current ripple.

N/C

VIN

Not connected

Input Supply. This supplies power to all the internal control circuitry, both BS

regulators and the high-side switch. A decoupling capacitor to ground must be

placed close to this pin to minimize switching spikes.

Bootstrap. This is the positive power supply for the internal floating high-side

MOSFET driver. Connect a bypass capacitor between this pin and SW pin.

BST

Switch Node. This is the output from the high-side switch. A low V_FSchottky

rectifier to ground is required. The rectifier must be close to the SW pins to reduce

switching spikes.

PWM Dimming Input. Pulling this pin below the specified threshold for dimming off.

Pulling it up above the specified threshold for dimming on. If there is no need for

dimming function, connect DIM and EN pins together.

DIM

Enable Input. Pulling this pin below the specified threshold shuts the chip down.

Pulling it up above the specified threshold or leaving it floating enables the chip.

GND,

Ground. It should be connected as close as possible to the output capacitor

Exposed avoiding the high current switch paths. Connect exposed pad to GND plane for

pad optimal thermal performance.

MP4688 Rev. 1.12

3/28/2012

www.MonolithicPower.com

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

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