MP4571 – 60V, 1A, SYNCHRONOUS STEP-DOWN CONVERTER
PCB Layout Guidelines (9)
An optimized PCB layout is critical for proper
operation. 4-layer layout is strongly
A
recommended to improve thermal performance.
For the best results, refer to Figure 7 and follow
the guidelines below:
1. Place high-current paths (GND, IN, and SW)
very close to the device with short, direct, and
wide traces.
2. Use large copper areas to minimize
conduction loss and thermal stress.
Top Layer and Top Silk
3. Place the ceramic input capacitors as close to
the IN and GND pins as possible to minimize
high frequency noise.
4. Place the T-type feedback resistors as close
as possible to the FB pin to ensure the trace
connecting to the FB pin is as short as
possible.
5. Route SW and BST away from sensitive
analog areas, such as FB.
6. Use multiple vias to connect the power
planes to the internal layer.
Inner Layer 1
Note:
9) The recommended PCB layout is based on the circuit in Figure
8.
Inner Layer 2
Bottom Layer and Bottom Silk
Figure 7: Recommended PCB Layout
MP4571 Rev. 1.1
2/22/2023
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