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ML22Q563-xxxMB PDF预览

ML22Q563-xxxMB

更新时间： 2024-01-02 03:53:58
品牌 Logo 应用领域
其他 - ETC 有原始数据的样本ROMISM频段光电二极管商用集成电路
页数 文件大小 规格书
66页 1186K
描述
4-Channel Mixing Speech Synthesis LSI

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ML22Q563-xxxMB 技术参数

生命周期：Active零件包装代码：SSOP
包装说明：SSOP-30针数：30
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.63商用集成电路类型：SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：R-PDSO-G30JESD-609代码：e6
长度：9.7 mm功能数量：1
端子数量：30片上内存类型：MASK ROM
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装等效代码：SSOP30,.3封装形状：RECTANGULAR
封装形式：SMALL OUTLINE认证状态：Not Qualified
最长读取时间：161 s座面最大高度：1.85 mm
最大压摆率：55 mA最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：2.7 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：TIN BISMUTH
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL宽度：5.6 mm
Base Number Matches：1

ML22Q563-xxxMB 数据手册

 浏览型号ML22Q563-xxxMB的Datasheet PDF文件第60页浏览型号ML22Q563-xxxMB的Datasheet PDF文件第61页浏览型号ML22Q563-xxxMB的Datasheet PDF文件第62页浏览型号ML22Q563-xxxMB的Datasheet PDF文件第63页浏览型号ML22Q563-xxxMB的Datasheet PDF文件第64页浏览型号ML22Q563-xxxMB的Datasheet PDF文件第65页 
FEDL2256X-06  
ML22Q563/ML2256X  
NOTES  
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS  
Semiconductor Co., Ltd.  
The content specified herein is subject to change for improvement without notice.  
Examples of application circuits, circuit constants and any other information contained herein illustrate the  
standard usage and operations of the Products. The peripheral conditions must be taken into account when  
designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document. However, should  
you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall  
bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and examples of  
application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any  
license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties.  
LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such  
technical information.  
The Products specified in this document are intended to be used with general-use electronic equipment or  
devices (such as audio visual equipment, office-automation equipment, communication devices, electronic  
appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard against the  
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as  
derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility  
whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction  
manual.  
The Products are not designed or manufactured to be used with any equipment, device or system which requires  
an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human  
life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace  
machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear  
no responsibility in any way for use of any of the Products for the above special purposes. If a Product is  
intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under  
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the  
Law.  
Copyright 2010-2013 LAPIS Semiconductor Co., Ltd.  
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