Datasheet > ML22765

ML22765

更新时间： 2024-02-03 20:27:57

品牌	Logo	应用领域
罗姆 - ROHM		/
页数	文件大小	规格书
74页	2287K
描述
P2ROM™内置型

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技术参数
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ML22765 技术参数

生命周期：	Active	零件包装代码：	SSOP
包装说明：	SSOP,	针数：	30
Reach Compliance Code：	unknown	风险等级：	5.79
其他特性：	IT ALSO OPERATES AT 4.5 TO 5.5 V NOMINAL SUPPLY VOLTAGE	最大时钟频率 (fCLK)：	0.4 MHz
JESD-30 代码：	R-PDSO-G30	长度：	9.7 mm
内存密度：	16777216 bit	内存集成电路类型：	OTP ROM
内存宽度：	1	功能数量：	1
端子数量：	30	字数：	16777216 words
字数代码：	16000000	工作模式：	SYNCHRONOUS
最高工作温度：	85 °C	最低工作温度：	-40 °C
组织：	16MX1	封装主体材料：	PLASTIC/EPOXY
封装代码：	SSOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH	并行/串行：	SERIAL
认证状态：	Not Qualified	座面最大高度：	1.85 mm
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	DUAL	宽度：	5.6 mm
Base Number Matches：	1

ML22765 数据手册

FEDL227XX-07

ML2272X-XXX/ML2276X-XXX

Notes

1) The information contained herein is subject to change without notice.

2) Although LAPIS Semiconductor is continuously working to improve product reliability and quality,

semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent

personal injury or fire arising from failure, please take safety measures such as complying with the

derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and

fail-safe procedures. LAPIS Semiconductor shall have no responsibility for any damages arising out of the

use of our Products beyond the rating specified by LAPIS Semiconductor.

3) Examples of application circuits, circuit constants and any other information contained herein are provided

only to illustrate the standard usage and operations of the Products.The peripheral conditions must be taken

into account when designing circuits for mass production.

4) The technical information specified herein is intended only to show the typical functions of the Products and

examples of application circuits for the Products. No license, expressly or implied, is granted hereby under

any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the

information contained in this document; therefore LAPIS Semiconductor shall have no responsibility

whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such

technical information.

5) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication,

consumer systems, gaming/entertainment sets) as well as the applications indicated in this document.

6) The Products specified in this document are not designed to be radiation tolerant.

7) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please

contact and consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships,

trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical

systems, servers, solar cells, and power transmission systems.

8) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment,

nuclear power control systems, and submarine repeaters.

9) LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non-compliance

with the recommended usage conditions and specifications contained herein.

10) LAPIS Semiconductor has used reasonable care to ensure the accuracy of the information contained in this

document. However, LAPIS Semiconductor does not warrant that such information is error-free and LAPIS

Semiconductor shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the

RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office.

LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non-compliance

with any applicable laws or regulations.

12) When providing our Products and technologies contained in this document to other countries, you must

abide by the procedures and provisions stipulated in all applicable export laws and regulations, including

without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade

Act.

13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS

Semiconductor.

2-4-8 Shinyokohama, Kouhoku-ku,

Yokohama 222-8575, Japan

http://www.lapis-semi.com/en/

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1...71 72 7374

中文翻译

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ML22804	ETC	LAPIS Semiconductor ADPCM Algorithm-Based Speech Synthesis LSI	获取价格
ML22804-XXXMB	OKI	Speech Synthesizer, PDSO30, 0.65 MM, PLASTIC, SSOP-30	获取价格
ML22808	ETC	LAPIS Semiconductor ADPCM Algorithm-Based Speech Synthesis LSI	获取价格
ML22808-XXXMB	OKI	Speech Synthesizer, PDSO30, 0.65 MM, PLASTIC, SSOP-30	获取价格

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