Table of Contents
1 Ordering parts...........................................................................3
5.4.1 Thermal operating requirements...........................21
5.4.2 Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1 JTAG electricals....................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1 MCG specifications...............................................25
6.3.2 Oscillator electrical specifications.........................27
6.3.3 32 kHz oscillator electrical characteristics.............30
6.4 Memories and memory interfaces.....................................30
6.4.1 Flash electrical specifications................................30
6.4.2 EzPort switching specifications.............................33
6.5 Security and integrity modules..........................................34
6.6 Analog...............................................................................34
6.6.1 ADC electrical specifications.................................35
6.6.2 CMP and 6-bit DAC electrical specifications.........39
6.6.3 12-bit DAC electrical characteristics.....................41
6.6.4 Voltage reference electrical specifications............44
6.7 Timers................................................................................45
6.8 Communication interfaces.................................................45
6.8.1 USB electrical specifications.................................45
6.8.2 USB DCD electrical specifications........................46
6.8.3 VREG electrical specifications..............................46
6.8.4 DSPI switching specifications (limited voltage
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
2.5 Small package marking.....................................................4
3 Terminology and guidelines......................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
requirements......................................................................7
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5 General.....................................................................................10
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.2.1 Voltage and current operating requirements.........11
5.2.2 LVD and POR operating requirements.................12
5.2.3 Voltage and current operating behaviors..............13
5.2.4 Power mode transition operating behaviors..........13
5.2.5 Power consumption operating behaviors..............14
5.2.6 EMC radiated emissions operating behaviors.......18
5.2.7 Designing with radiated emissions in mind...........19
5.2.8 Capacitance attributes..........................................19
5.3 Switching specifications.....................................................19
5.3.1 Device clock specifications...................................19
5.3.2 General switching specifications...........................20
5.4 Thermal specifications.......................................................21
range)....................................................................47
6.8.5 DSPI switching specifications (full voltage range).48
6.8.6 I2C switching specifications..................................50
6.8.7 UART switching specifications..............................50
6.8.8 Normal Run, Wait and Stop mode performance
over the full operating voltage range.....................50
6.8.9 VLPR, VLPW, and VLPS mode performance
over the full operating voltage range.....................52
7 Dimensions...............................................................................54
7.1 Obtaining package dimensions.........................................54
8 Pinout........................................................................................54
8.1 K22 Signal Multiplexing and Pin Assignments..................54
8.2 K22 Pinouts.......................................................................59
9 Revision History........................................................................60
K22 Sub-Family Data Sheet, Rev. 4, 08/2013.
2
Freescale Semiconductor, Inc.
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