MIC2010/2070
Micrel
Functional Diagram
MAIN
Current
Limit
MAIN
FET
Charge Pump
+
Gate Control
EN
OUT
AUX
AUX
FET
S3#
Current
Limit
RSET
Thermal
Sense
AUX
*
* 'P' options only
10ms
Timer
Latch
/FAULT
*MIC2070-1/2 Only
To Other Channel
TJ = P × θ + T
A
where:
Functional Description
D
JA
The MIC2010/2070 are designed to support the power distri-
butionrequirementsforUSBwakeupfromtheACPIS3state.
It integrates two independent channels under control of input
S3#.WhenS3#isassertedLOW(ACPIS3state)theMIC2010/
2070 will switch a 500mΩ MOSFET switch from the AUX
input to each of its two outputs. In addition the current-limit
threshold will be set to a value specified by a resistor
connected to the RSET inputs. Conversely when the S3#
inputisHIGHtheMIC2010/2070willswitcha100mΩMOSFET
switch from the MAIN inputs to each of its two outputs. The
current-limit threshold is preset to 500mA in this state. The
lower current limit during the ACPI S3 state helps to ensure
thatthestandbysupplymaintainsregulationevenduringfault
conditions.
T = junction temperature
J
T = ambient temperature
A
θ
= is the thermal resistance of the package
JA
Current Sensing and Limiting
The current-limit threshold of each channel is preset inter-
nally at 500mA when S3# is deasserted. When S3# is
asserted the current-limit threshold is specified by a resistor
connected to the RSET input. The value of the current-limit
thresholdisdeterminedbytheequation18/R
ohmswhere
SET
R
is the resistance connected between the RSET pin and
ground. The current-limit threshold should be set at 1.2X of
the applications continous output current requirement.
SET
When an overcurrent condition lasts longer than t
the
Thermal Shutdown
DLY
MIC2070 will activate an internal circuit breaker that will latch
the output off and assert FAULT. The output will remain off
until either the load is removed or EN is toggled. When the
MIC2070 enters a latched output condition a 1mA pull-up
current source is activated. This provides a way to automati-
cally reset the output once the load is removed without the
need to toggle the enable input. Please refer to Figure 7 for
timing details.
Thermal shutdown is employed to protect the device from
damage should the die temperature exceed safe margins
due mainly to short circuit faults. Thermal shutdown shuts off
the output MOSFET and asserts the FAULT output if the die
temperaturereaches140°Candtheoverheatedchannelisin
currentlimit.Theotherchannelisnotaffected.Ifhowever,the
die temperature exceeds 160°C, both channels will be shut
off even if neither channel is in current limit.
The MIC2010 will automatically reset its output when the die
temperature cools down to 120°C. The MIC2010 output and
FAULT signal will continue to cycle on and off until the device
is disabled or the fault is removed. Figure 6 depicts typical
timing. Depending on PCB layout, package, ambient tem-
perature, etc., it may take several hundred milliseconds from
the incidence of the fault to the output MOSFET being shut
Power Dissipation
The device’s junction temperature depends on several fac-
tors such as the load, PCB layout, ambient temperature and
package type. The power dissipated in each channel is
2
P =R
×I
whereR
istheon-resistanceofthe
DS(on)
D
DS(on) OUT
internal MOSFETs and I
is the continuous output current.
OUT
Total power dissipation of the device will be the summation of
P for both channels. To relate this to junction temperature,
D
the following equation can be used:
January 2005
7
M9999-101104