MITSUBISHI (OPTICAL DEVICES)
MF-27WXD Series
2.5Gbps SFP TRANSCEIVER MODULE
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products.
Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that result in injury, death, fire or
environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire
prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning!
1. Eye safety : Semiconductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human eyes. Don't look
at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-viewer, or other appropriate
instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder
or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and
general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless
their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that
may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical
equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down,
tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking
enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described
below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be
maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for
six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering
problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing.
Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls
than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive
gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may
lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed
those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this
product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder
irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly
recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention
to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to
carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge,
eliminate it rapidly, and prevent it from spreading.
The end of document
UQ9-06-008 Ed:1.0 Date:10.Oct.2006
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