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MCZ33972EW PDF预览

MCZ33972EW

更新时间： 2024-01-24 17:47:10
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 接口集成电路光电二极管
页数 文件大小 规格书
32页 1303K
描述
Multiple Switch Detection Interface with Suppressed Wake-Up

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MCZ33972EW 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOIC
包装说明：0.65 MM PITCH, LEAD FREE, SOIC-32针数：32
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.31.00.01风险等级：5.81
Is Samacsys：N接口集成电路类型：INTERFACE CIRCUIT
JESD-30 代码：R-PDSO-G32JESD-609代码：e3
长度：11 mm湿度敏感等级：3
功能数量：1端子数量：32
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：2.65 mm最大供电电压：5.25 V
最小供电电压：3.1 V标称供电电压：3.3 V
电源电压1-最大：26 V电源电压1-分钟：8 V
电源电压1-Nom：13 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7.5 mmBase Number Matches：1

MCZ33972EW 数据手册

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ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 3. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS  
VDD Supply Voltage  
V
DC  
CS, SI, SO, SCLK, INT, AMUX(1)  
–
-0.3 to 7.0  
(1)  
WAKE  
–
–
–
–
–
-0.3 to 40  
-0.3 to 50  
-0.3 to 45  
-14 to 40  
6.0  
V
V
V
V
DC  
DC  
DC  
DC  
VPWR Supply Voltage(1)  
VPWR Supply Voltage at -40C(1)  
Switch Input Voltage Range  
Frequency of SPI Operation (VDD = 5.0V)  
ESD Voltage(3)  
MHz  
V
VESD  
±2000  
±2000  
±200  
Human Body Model(2)  
Applies to all non-input pins  
Machine Model  
Charge Device Model  
Corner Pins  
750  
500  
Interior Pins  
THERMAL RATINGS  
Operating Temperature  
Ambient  
°C  
TA  
TJ  
-40 to 125  
-40 to 150  
-55 to 150  
1.7  
Junction  
Storage Temperature  
Power Dissipation (TA = 25°C)(4)  
T
°C  
W
STG  
PD  
Thermal Resistance  
Non-Exposed Pad  
Junction to Ambient  
Junction to Lead  
°C/W  
R
74  
25  
JA  
θ
R
JL  
θ
Exposed Pad  
Junction to Ambient  
Junction to Exposed Pad  
R
71  
1.2  
JA  
JC  
θ
R
θ
Peak Package Reflow Temperature During Reflow(5), (6)  
TPPRT  
Note 6.  
°C  
Notes  
1. Exceeding these limits may cause malfunction or permanent damage to the device.  
2. ESD data available upon request.  
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100pF, RZAP = 1500Ω), and ESD2 testing is performed  
in accordance with the Machine Model (CZAP = 200pF, RZAP = 0Ω).  
4. Maximum power dissipation at TJ = 150°C junction temperature with no heat sink used.  
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes  
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.  
33972  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
12345678...32

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