是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | HSSOP, | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.18 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | R-PDSO-G32 |
JESD-609代码: | e3 | 长度: | 11 mm |
湿度敏感等级: | 3 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 32 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 2.45 mm |
最大供电电压 (Vsup): | 28 V | 最小供电电压 (Vsup): | 5.5 V |
标称供电电压 (Vsup): | 10.5 V | 表面贴装: | YES |
技术: | MOS | 温度等级: | AUTOMOTIVE |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 7.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCZ33905CS3EK-R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905CS5EK | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905CS5EK | NXP |
获取价格 |
POWER SUPPLY MANAGEMENT CKT | |
MCZ33905CS5EKR2 | NXP |
获取价格 |
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32, Reel | |
MCZ33905CS5EK-R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905D3EK | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905D3R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905D5EK | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905D5EK | NXP |
获取价格 |
5.0V SBC HSCAN DUAL LIN | |
MCZ33905D5EK/R2 | FREESCALE |
获取价格 |
System Basis Chip Gen2 with High Speed CAN and LIN Interface |