生命周期: | Obsolete | 包装说明: | HSSOP, |
Reach Compliance Code: | unknown | 风险等级: | 5.68 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PDSO-G54 | 长度: | 17.9 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 54 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | 座面最大高度: | 2.45 mm |
最大供电电压 (Vsup): | 28 V | 最小供电电压 (Vsup): | 5.5 V |
标称供电电压 (Vsup): | 10.5 V | 表面贴装: | YES |
技术: | MOS | 温度等级: | AUTOMOTIVE |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 宽度: | 7.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MCZ33905CD5EKR2 | NXP |
获取价格 |
System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32, Reel | |
MCZ33905CD5EK-R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905CS3EK | NXP |
获取价格 |
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 3/4 wakeup, SOIC 32, Rail | |
MCZ33905CS3EKR2 | NXP |
获取价格 |
POWER SUPPLY MANAGEMENT CKT | |
MCZ33905CS3EK-R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905CS5EK | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905CS5EK | NXP |
获取价格 |
POWER SUPPLY MANAGEMENT CKT | |
MCZ33905CS5EKR2 | NXP |
获取价格 |
System Basis Chip, LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC 32, Reel | |
MCZ33905CS5EK-R2 | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface | |
MCZ33905D3EK | FREESCALE |
获取价格 |
SBC Gen2 with CAN High Speed and LIN Interface |