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MCT0603ME3361BPW00 PDF预览

MCT0603ME3361BPW00

更新时间： 2023-07-15 00:00:00
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 161K
描述
RESISTOR, THIN FILM, 0.125 W, 0.1 %, 15 ppm, 3360 ohm, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

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MCT0603ME3361BPW00 数据手册

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MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision  
Precision Thin Film Chip Resistor  
Vishay Beyschlag  
Superior Moisture Resistivity  
DIMENSIONS  
T1  
WT  
W
H
T2  
L
DIMENSIONS AND MASS  
H
L
W
(mm)  
WT  
(mm)  
T1  
(mm)  
T2  
(mm)  
MASS  
(mg)  
TYPE  
(mm)  
(mm)  
MCT 0603 AT 0.45 + 0.1/- 0.05  
1.55 0.05  
2.0 0.1  
0.85 0.1  
> 75 % of W  
> 75 % of W  
> 75 % of W  
0.3 + 0.15/- 0.2  
0.4 + 0.1/- 0.2  
0.5 0.25  
0.3 + 0.15/- 0.2  
0.4 + 0.1/- 0.2  
0.5 0.25  
1.9  
4.6  
9.2  
MCU 0805 AT  
MCA 1206 AT  
0.52 0.1  
0.55 0.1  
1.25 0.15  
1.6 0.15  
3.2 + 0.1/- 0.2  
SOLDER PAD DIMENSIONS  
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS  
WAVE SOLDERING  
REFLOW SOLDERING  
TYPE  
G
(mm)  
Y
(mm)  
X
(mm)  
Z
G
(mm)  
Y
(mm)  
X
(mm)  
Z
(mm)  
(mm)  
MCT 0603 AT  
MCU 0805 AT  
MCA 1206 AT  
0.5  
0.65  
1.5  
1.2  
1.4  
1.6  
1.1  
1.5  
1.9  
2.9  
0.5  
0.65  
1.5  
0.95  
1.1  
0.95  
1.4  
2.4  
2.85  
4.0  
3.45  
4.7  
1.25  
1.75  
Note  
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of  
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain the  
reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on boardmaterials.  
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in  
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other  
parameters.  
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.  
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent  
conductor areas.  
Document Number: 28785  
Revision: 09-Apr-09  
For technical questions, contact: filmresistors.thinfilmchip@vishay.com  
www.vishay.com  
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