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MCP23008-E/SO PDF预览

MCP23008-E/SO

更新时间: 2024-01-22 15:54:46
品牌 Logo 应用领域
美国微芯 - MICROCHIP 并行IO端口微控制器和处理器外围集成电路光电二极管PC
页数 文件大小 规格书
40页 500K
描述
8-Bit I/O Expander with Serial Interface

MCP23008-E/SO 技术参数

生命周期:Active包装说明:SSOP-20
Reach Compliance Code:compliant风险等级:5.73
JESD-30 代码:R-PDSO-G20长度:7.2 mm
I/O 线路数量:8端口数量:1
端子数量:20最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH筛选级别:AEC-Q100
座面最大高度:2 mm最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:5.3 mmuPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches:1

MCP23008-E/SO 数据手册

 浏览型号MCP23008-E/SO的Datasheet PDF文件第34页浏览型号MCP23008-E/SO的Datasheet PDF文件第35页浏览型号MCP23008-E/SO的Datasheet PDF文件第36页浏览型号MCP23008-E/SO的Datasheet PDF文件第38页浏览型号MCP23008-E/SO的Datasheet PDF文件第39页浏览型号MCP23008-E/SO的Datasheet PDF文件第40页 
MCP23008/MCP23S08  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
Examples:  
PART NO.  
Device  
X
/XX  
a) MCP23008-E/P:  
Extended Temp.,  
18LD PDIP package.  
Temperature  
Range  
Package  
b) MCP23008-E/SO: Extended Temp.,  
18LD SOIC package.  
2
c) MCP23008T-E/SO: Tape and Reel,  
Extended Temp.,  
Device  
MCP23008:  
8-Bit I/O Expander w/ I C™ Interface  
2
MCP23008T: 8-Bit I/O Expander w/ I C Interface  
(Tape and Reel)  
18LD SOIC package.  
d) MCP23008-E/SS: Extended Temp.,  
20LD SSOP package.  
MCP23S08:  
8-Bit I/O Expander w/ SPI™ Interface  
MCP23S08T: 8-Bit I/O Expander w/ SPI Interface  
(Tape and Reel)  
e) MCP23008T-E/SS: Tape and Reel,  
Extended Temp.,  
20LD SSOP package.  
Temperature  
Range  
E
=
-40°C to +125°C (Extended) *  
a) MCP23S08-E/P:  
Extended Temp.,  
18LD PDIP package.  
* While these devices are only offered in the “E”  
temperature range, the device will operate at different  
voltages and temperatures as identified in the  
Section 2.0 “Electrical Characteristics”.  
b) MCP23S08-E/SO: Extended Temp.,  
18LD SOIC package.  
c) MCP23S08T-E/SO: Tape and Reel,  
Extended Temp.,  
18LD SOIC package.  
d) MCP23S08-E/SS: Extended Temp.,  
20LD SSOP package.  
Package  
P
SO  
SS  
=
=
=
Plastic DIP (300 mil Body), 18-Lead  
Plastic SOIC (300 mil Body), 18-Lead  
SSOP, (209 mil Body, 5.30 mm), 20-Lead  
e) MCP23S08T-E/SS: Tape and Reel,  
Extended Temp.,  
20LD SSOP package.  
© 2005 Microchip Technology Inc.  
DS21919B-page 37  

MCP23008-E/SO 替代型号

型号 品牌 替代类型 描述 数据表
MCP23009-E/SO MICROCHIP

完全替代

8-Bit I/O Expander with Open-Drain Outputs
MCP23S09-E/SO MICROCHIP

完全替代

8-Bit I/O Expander with Open-Drain Outputs
MCP23S08-E/SO MICROCHIP

完全替代

8-Bit I/O Expander with Serial Interface

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