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MCM63F819TQ9 PDF预览

MCM63F819TQ9

更新时间: 2024-10-03 04:40:27
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 静态存储器内存集成电路
页数 文件大小 规格书
21页 320K
描述
256KX18 CACHE SRAM, 9ns, PQFP100, TQFP-100

MCM63F819TQ9 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.63
最长访问时间:9 ns其他特性:FLOW-THROUGH ARCHITECTURE
JESD-30 代码:R-PQFP-G100长度:20 mm
内存密度:4718592 bit内存集成电路类型:CACHE SRAM
内存宽度:18功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

MCM63F819TQ9 数据手册

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MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Order this document  
by MCM63F737/D  
MCM63F737  
MCM63F819  
128K x 36 and 256K x 18 Bit  
Flow–Through BurstRAM  
Synchronous Fast Static RAM  
The MCM63F737 and MCM63F819 are 4M–bit synchronous fast static RAMs  
designed to provide a burstable, high performance, secondary cache for the  
PowerPC and other high performance microprocessors. The MCM63F737 is  
organized as 128K words of 36 bits each and the MCM63F819 is organized as  
256K words of 18 bits each. These devices integrate input registers, a 2–bit  
address counter, and high speed SRAM onto a single monolithic circuit for  
reduced parts count in cache data RAM applications. Synchronous design  
allows precise cycle control with the use of an external clock (K).  
Addresses (SA), data inputs (DQx), and all control signals except output  
enable(G), sleepmode(ZZ), andlinearburstorder(LBO)areclock(K)controlled  
through positive–edge–triggered noninverting registers.  
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst  
addresses can be generated internally by the MCM63F737 and MCM63F819  
(burstsequenceoperatesinlinearorinterleavedmodedependentuponthestate  
of LBO) and controlled by the burst address advance (ADV) input pin.  
Write cycles are internally self–timed and are initiated by the rising edge of the  
clock (K) input. This feature eliminates complex off–chip write pulse generation  
and provides increased timing flexibility for incoming signals.  
TQ PACKAGE  
TQFP  
CASE 983A–01  
ZP PACKAGE  
PBGA  
CASE 999–02  
Synchronous byte write (SBx), synchronous global write (SGW), and  
synchronous write enable (SW) are provided to allow writes to either individual  
bytes or to all bytes. The bytes are designated as “a”, “b”, etc. SBa controls DQa,  
SBb controls DQb, etc. Individual bytes are written if the selected byte writes SBx  
are asserted with SW. All bytes are written if either SGW is asserted or if all SBx  
and SW are asserted.  
For read cycles, a flow–through SRAM allows output data to simply flow freely  
from the memory array.  
The MCM63F737 and MCM63F819 operate from a 3.3 V core power supply  
and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and outputs  
are JEDEC standard JESD8–5 compatible.  
MCM63F737/MCM63F819–8.5 = 8.5 ns Access  
MCM63F737/MCM63F819–9 ns = 9 ns Access  
MCM63F737/MCM63F810–10 ns = 10 ns Access  
3.3 V + 10%, – 5% Core Power Supply, 2.5 V or 3.3 V I/O Supply  
ADSP, ADSC, and ADV Burst Control Pins  
Selectable Burst Sequencing Order (Linear/Interleaved)  
Single–Cycle Deselect Timing  
Internally Self–Timed Write Cycle  
Byte Write and Global Write Control  
Sleep Mode (ZZ)  
JEDEC Standard 100–Pin TQFP and 119–Pin PBGA Packages  
The PowerPC name is a trademark of IBM Corp., used under license therefrom.  
REV 2  
3/12/99  
Motorola, Inc. 1999  

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