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MCM2012B221FBP PDF预览

MCM2012B221FBP

更新时间: 2022-02-26 10:31:49
品牌 Logo 应用领域
优恩 - UNSEMI /
页数 文件大小 规格书
8页 1816K
描述
(Chip Common Mode Filter) Engineering Specification

MCM2012B221FBP 数据手册

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(Chip Common Mode Filter) Engineering Specification  
MCM2012B Series  
Features and Application  
Powerful components with composite co-fired material to  
solve EMI problem for high speed differential signal  
transmission line as USB, and LVDS, without distortion to high  
speed signal transmission  
PRODUCT DETAIL  
Imp.Com.  
(Ω)±25%  
@100MHz  
DCR  
Max.  
(Ω)  
Rated  
Current  
Max.(m A)  
Rated  
Voltage  
(V)  
Withstand  
Voltage  
(V)  
Insulation  
Resistance  
Min.(MΩ)  
Part Number  
MCM2012B670GBE  
MCM2012B900GBE  
MCM2012B121GBE  
MCM2012B161GBE  
MCM2012B181GBE  
MCM2012B221FBP  
67  
0.40  
0.40  
0.40  
0.50  
0.50  
0.50  
400  
400  
400  
400  
400  
300  
10  
10  
10  
10  
10  
10  
25  
25  
25  
25  
25  
25  
200  
200  
200  
200  
200  
200  
90  
120  
160  
180  
220  
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER  
HP4338 MILLIOHMMETER  
Test Instruments  
Agilent E5071C ENA SERIES NETWORK ANALYZER  
Keithley 2410 1100V SOURCE METER  
PART NUMBER CODE  
MCM 2012 B 90 0 G B E  
1
2
3
4 5 6 7 8  
1: Series name  
2: Size Code:the first two digitals:length(mm),the last two digitals:width(mm)  
3: Material code  
4: Impedance(Ω) ±25%  
5: Fixed Decimal Point  
(ex900=90121=120)  
6: Rated Current Code  
A=50mA  
B=80mA  
C=100mA D=150mA E=200mA F=300mA  
J=700mA K=800mA  
G=400mA H=500mA I=600mA  
7: Soldering:Green Parts:A-Soldering Lead-Free B-Lead-Free for whole chip  
8: Packaging style E Embossed paper tape, 7reel.  
UN Semiconductor Co., Ltd.  
www.unsemi.com.tw  
@ UN Semiconductor Co., Ltd. 2018  
Revision May 8, 2018  
1 / 8  
Specifications are subject to change without notice.  

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