Datasheet > MCI1608HQ3N9SHBP

MCI1608HQ3N9SHBP

更新时间： 2024-04-09 18:57:40

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	449K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 3.9, 10, 1000mA

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MCI1608HQ3N9SHBP 数据手册

10. Land Patterns Reflow Soldering

⚫ Solder Land Information

TYPE

(mm)

1.9 ～ 2.3

0.6 ～ 0.8

1608

0.7

(0.075 ～ 0.091)

(0.024 ～ 0.031)

(EIA 0603)

(0.028)

11. Reliability Performance

Item

Test Condition

Requirements

1. No mechanical damage

2. Inductance value should

be within ± 10 % of the

initial value

3. Q value should be within

± 20% of the initial value

1. Temperature : -55 ~ +125℃

2. Cycle : 100 cycles

3. Dwell time : 30minutes

4. Measurement : at ambient temperature 24

hrs after test completion

Thermal Shock

1. No mechanical damage

2. Inductance value should

be within ± 10 % of the

initial value

3. Q value should be within

± 20% of the initial value

1. Temperature: 85 ± 5℃

2. Testing time: 1000 hrs

Operational Life 3. Applied current: Full rated current

4. Measurement: At ambient temperature 24

hours after test completion

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