Datasheet > MCI1608HH3N9SHBP

MCI1608HH3N9SHBP

更新时间： 2024-04-09 18:56:41

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
15页	844K
描述
Multi-Layer High Frequency Chip Inductor(AEC-Q200) / MCI Automotive Series 3.9, 10, 1000mA

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MCI1608HH3N9SHBP 数据手册

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Item

Test Condition

Requirements

1.No mechanical damage

2.Inductance value should be

within ± 10 % of the initial

value

3. Q value should be within

± 20% of the initial value

5g's for 20 minutes,12cycles each of 3

orientations

Test from 10-2000Hz.,12cycles each of 3

orientations

Vibration Test

1.Solder temperature : 260 ± 5℃

2.Flux : Rosin

3.DIP time : 10 ± 1 sec

1.More than 95 % of terminal

electrode should be covered

with new solder

2.No mechanical damage

3.Inductance value should be

within ± 10 % of the initial

value

Resistance to

Solder Heat

4. Q value should be within

± 20% of the initial value

1. No mechanical damage

2. Inductance variation

within10%.

Classification Levels 1C

ESD

3. Q value should be within

± 20% of the initial value

1.More than 95 % of terminal

electrode should be covered

with new solder

1.Solder temperature : 235 ± 5℃

2.Flux : Rosin

3.DIP time : 5 ± 1 sec

Solderability Test

Board Flex

2.No mechanical damage

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

60s minimum holding time

No mechanical damage.

Size

Apply Force(F)

Test Time

0603

1005

1608

2 N

5 N

10 +1 sec.

No mechanical damage

Terminal Strength

10 N



NOTE

The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid

exposing the product to saline moisture. If the product is exposed to such atmospheres,

the terminals will oxidize and solderability will be affected.

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