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MCI1005HQ8N2GHBP PDF预览

MCI1005HQ8N2GHBP

更新时间: 2024-04-09 18:56:51
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
9页 462K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 8.2, 8, 0.5A

MCI1005HQ8N2GHBP 数据手册

 浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第3页浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第4页浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第5页浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第6页浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第7页浏览型号MCI1005HQ8N2GHBP的Datasheet PDF文件第9页 
10. Land Patterns Reflow Soldering  
Solder Land Information  
TYPE  
A
B
C
(mm)  
1.4 1.5  
0.5 0.6  
0.4  
1005  
(0.055 0.059)  
(0.020 0.024)  
(EIA 0402)  
(0.016)  
11. Reliability Performance  
Item  
Test Condition  
Requirements  
1. No mechanical damage  
2. Inductance value should  
be within ± 10 % of the  
initial value  
3. Q value should be within  
± 20% of the initial value  
1. Temperature : -55 ~ +125℃  
2. Cycle : 100 cycles  
3. Dwell time : 30minutes  
4. Measurement : at ambient temperature 24  
hrs after test completion  
Thermal Shock  
1. No mechanical damage  
2. Inductance value should  
be within ± 10 % of the  
initial value  
3. Q value should be within  
± 20% of the initial value  
1. Temperature: 85 ± 5℃  
2. Testing time: 1000 hrs  
Operational Life 3. Applied current: Full rated current  
4. Measurement: At ambient temperature 24  
hours after test completion  
Page 8 of 9  

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