Datasheet > MCI0603HQ2N9SHBP

MCI0603HQ2N9SHBP

更新时间： 2024-04-09 18:56:46

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	509K
描述
Multi-Layer High Frequency Chip Inductor / MCI Series 2.9, 5, 450mA

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MCI0603HQ2N9SHBP 数据手册

Item

Test Condition

Requirements

1. Solder the chip to test jig then apply a

force in the direction shown in below.

2. The soldering shall be done with the

reflow method and shall be conducted with

care so that the soldering is uniform and free

of defects such as heat shock.

Bending Strength

No mechanical damage

⚫ NOTE

The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid

exposing the product to saline moisture. If the product is exposed to such atmospheres,

the terminals will oxidize and solderability will be affected.

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